Abstract
The reason for the effective removal of interface traps in SiO2/4H-SiC (0001) structures by boron (B) incorporation was investigated by employing low-temperature electrical measurements. Low-temperature capacitance–voltage and thermal dielectric relaxation current measurements revealed that the density of electrons captured in slow interface traps in B-incorporated oxide is lower than that in dry and NO-annealed oxides. These results suggest that near-interface traps can be removed by B incorporation, which is considered to be an important reason for the increase in the field-effect mobility of 4H-SiC metal–oxide–semiconductor devices. A model for the passivation mechanism is proposed that takes account of stress relaxation during thermal oxidation.
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Acknowledgements
This work was supported by JSPS KAKENHI Grant Number 26820136 [Grant-in-Aid for Young Scientists (B)]. We thank T. Fuyuki and A. Tani at Nara Institute of Science and Technology (NAIST) for their help with the low-temperature measurements. We also thank the AIST SiC Power Device Team for useful discussions.
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Okamoto, D., Sometani, M., Harada, S. et al. Effect of boron incorporation on slow interface traps in SiO2/4H-SiC structures. Appl. Phys. A 123, 133 (2017). https://doi.org/10.1007/s00339-016-0724-1
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DOI: https://doi.org/10.1007/s00339-016-0724-1