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A lower-melting-point solder alloy for surface mounts

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Abstract

Significant manufacturing cost reductions can be realized with lower-temperature surface mount processing by increasing yields and using less expensive components and boards. A lower-melting-point solder alloy (nominal composition Sn-41.75Pb-8Bi0.5Ag) has been developed that enables significant reductions in peak reflow temperatures during surface-mount assembly. The solder alloy is compatible with standard Pb-Sn surface finishes, melts within the temperature range of ≈166–172°C,andhas promising mechanical properties.

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References

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Authors and Affiliations

  1. Bell Laboratories Lucent Technologies, USA

    M. T. McCormack Ph.D. (technical staff member, member of TMS), Y. Degani Ph.D. (technical staff member) & H. S. Chen Ph.D. (technical staff member)

  2. Advanced Metals Technology and Amtech, USA

    W. R. Gesick B.S. (president)

Authors
  1. M. T. McCormack Ph.D.
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  2. Y. Degani Ph.D.
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  3. H. S. Chen Ph.D.
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  4. W. R. Gesick B.S.
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McCormack, M.T., Degani, Y., Chen, H.S. et al. A lower-melting-point solder alloy for surface mounts. JOM 48, 54–56 (1996). https://doi.org/10.1007/BF03222945

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  • DOI: https://doi.org/10.1007/BF03222945

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