Abstract
A brief history for development of polyimidesiloxanes is provided. Many useful properties of SIM materials, such as processing conditions, adhesion properties, water absorption, Tg’s, electrical and thermal properties, and Young’s Modulus are revealed. The SIM materials discussed in the present article, are state of the polyimidesiloxanes, which represent the best combinations of advantageous properties for high density packaging applications: They have the best combinations of high Tg’s, thermal stability with low water absorption, moduli and dielectric constants.
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Lee, C.J. Polyimidesiloxanes: Emerging materials for advanced packaging applications. J. Electron. Mater. 18, 313–318 (1989). https://doi.org/10.1007/BF02657423
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DOI: https://doi.org/10.1007/BF02657423