Abstract
The heat dissipation effects of elevated pressure and cold gas temperature on vertically configured module mounted and free hanging chips were examined. It was found that with both types of chips, the thermal resistance (temperature rise x area/power) varies linearly with pressure in a log-log plot. A free hanging chip exhibits a (-1/3) power dependency on pressure while the module mounted chip exhibits a (-1/5) power dependency on pressure. The thermal resistance of the module mounted chip also appears to exhibit a dependency on gas temperature, but not on the difference in temperature between the chip and cold gas. The thermal resistance of the module mounted chip is some 5x lower than that of the free hanging chip, demonstrating that the module acts to a degree as a thermal expander. The efficiency is less than 20% based on the fact that the module area is some 30x greater than the chip area. For the module mounted chip, and a combination of a liquid nitrogen gas temperature and 1500 psi ambient atmosphere pressure, > 30 W/chip (0.180 in. × 0.180 in.) (0.46 cm × 0.46 cm), can be dissipated with a temperature rise to 85°C. This translates to a heat dissipation capability of more than 900 W/in2.
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Because psi is a normally used dimension and pressure gauges are scaled in this unit, psi are used throughout. Further, in defining chip power levels, W/in2 is used commonly. Power levels are given in this dimension as well as in W/cm2.
F. Kreith ‘Principles of Heat Transfer’, Intext Education Publishers, 257 Park Avenue S, New York, NY 10010, 1973 p. 396.
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R. K. MacGregor and A. P. Emery, J. Heat Transfer,19 391 (1969).
L. B. Evans and N. E. Stefany, AICHE Paper No. 4, Heat Transfer Conference, Los Angeles, CA, August 1965.
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Reisman, A., Berkenblit, M., Merz, C.J. et al. Heat dissipation from silicon chips in a vertical plate, elevated pressure cold wall system. J. Electron. Mater. 11, 391–411 (1982). https://doi.org/10.1007/BF02654679
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DOI: https://doi.org/10.1007/BF02654679