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Splitting and Transport of a Droplet with No External Actuation Force for Lab on Chip Devices

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VLSI Design and Test (VDAT 2017)

Part of the book series: Communications in Computer and Information Science ((CCIS,volume 711))

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Abstract

In this work, we have presented a new droplet splitting and transport mechanism using surface wetting phenomenon for lab on chip devices. The proposed methodology can be well utilized to split and transport a droplet without application of any external force or voltage. A 3D multiphase lattice Boltzmann algorithm with partial wetting surface is developed and simulated using D3Q19 model. A superhydrophobic surface is realized experimentally using a selective painting approach. The experimental results validated the predicted result. The surface free energy characteristics are obtained and analyzed with respect to time for droplet transportation.

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Acknowledgement

The authors would like to acknowledge NPMASS/ADA for the financial support for the establishment of a National MEMS design center at VNIT. We also thanks INUP (Indian Nano User Program) of CEN, IIT Bombay for providing the opportunity to carry out SEM characterization of the fabricated surfaces.

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Authors and Affiliations

  1. Centre for VLSI and Nanotechnology, Visvesvaraya National Institute of Technology, Nagpur, 440010, MH, India

    T. Pravinraj & Rajendra Patrikar

Authors
  1. T. Pravinraj
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  2. Rajendra Patrikar
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Corresponding author

Correspondence to T. Pravinraj .

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Editors and Affiliations

  1. Indian Institute of Technology Roorkee, Roorkee, India

    Brajesh Kumar Kaushik

  2. Indian Institute of Technology Roorkee, Roorkee, India

    Sudeb Dasgupta

  3. Indian Institute of Technology Bombay, Mumbai, India

    Virendra Singh

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Pravinraj, T., Patrikar, R. (2017). Splitting and Transport of a Droplet with No External Actuation Force for Lab on Chip Devices. In: Kaushik, B., Dasgupta, S., Singh, V. (eds) VLSI Design and Test. VDAT 2017. Communications in Computer and Information Science, vol 711. Springer, Singapore. https://doi.org/10.1007/978-981-10-7470-7_66

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  • DOI: https://doi.org/10.1007/978-981-10-7470-7_66

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  • Publisher Name: Springer, Singapore

  • Print ISBN: 978-981-10-7469-1

  • Online ISBN: 978-981-10-7470-7

  • eBook Packages: Computer ScienceComputer Science (R0)

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