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Deformation Behavior of TiAl Compounds with the TiAl/Ti3Al Lamellar Microstructure

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Ordered Intermetallics — Physical Metallurgy and Mechanical Behaviour

Part of the book series: NATO ASI Series ((NSSE,volume 213))

Abstract

In the last few years, substantial progress has been made in our understanding of the microstructure and the deformation and fracture behavior of TiAl compounds. We have made uniaxial tension tests of specimens of the TiAl compounds whose lamellar orientation is controlled so that shear deformation occurs parallel to the lamellar boundaries only in the TiAl lamellae. Then, the TiAl phase itself, which is in equilibrium with the Ti3Al phase, has been found to be easily deformable, and yet brittle fracture occurs in the TiAl phase when the specimens fail. This paper reviews such a deformation and fracture behavior of the TiAl phase together with some key aspects of the progress that was made on TiAl compounds with the TiAl/Ti3Al lamellar microstructure.

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Authors and Affiliations

  1. Department of Metal Science and Technology, Kyoto University, Sakyo-ku, Kyoto 606, Japan

    M. Yamaguchi & H. Inui

Authors
  1. M. Yamaguchi
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  2. H. Inui
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Editor information

Editors and Affiliations

  1. Metals and Ceramics Division, Oak Ridge National Laboratory, Oak Ridge, Tennessee, USA

    C. T. Liu

  2. Department of Materials Science and Metallurgy, University of Cambridge, Cambridge, UK

    R. W. Cahn

  3. Max-Planck-Institut für Eisenforschung GmbH, Düsseldorf, Deutschland

    G. Sauthoff

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© 1992 Springer Science+Business Media Dordrecht

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Yamaguchi, M., Inui, H. (1992). Deformation Behavior of TiAl Compounds with the TiAl/Ti3Al Lamellar Microstructure. In: Liu, C.T., Cahn, R.W., Sauthoff, G. (eds) Ordered Intermetallics — Physical Metallurgy and Mechanical Behaviour. NATO ASI Series, vol 213. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-2534-5_16

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  • DOI: https://doi.org/10.1007/978-94-011-2534-5_16

  • Publisher Name: Springer, Dordrecht

  • Print ISBN: 978-94-010-5119-4

  • Online ISBN: 978-94-011-2534-5

  • eBook Packages: Springer Book Archive

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