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Materials Issues Affecting the New Superconducting Electronics

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The New Superconducting Electronics

Part of the book series: NATO ASI Series ((NSSE,volume 251))

Abstract

Many materials issues are important for electronic applications of high temperature superconductors. In the first part of this chapter, a list of the requirements that must be satisfied by the materials to be used in various types of superconducting electronics is developed. This is followed by a discussion of the various high temperature superconducting compounds and their relative merits for various applications. A wide variety of growth techniques have been used to fabricate thin films of these materials. These techniques vary significantly in their strengths and weaknesses and their possible applicability to device fabrication. The more important growth techniques and their potential importance for electronic applications is described. Any successful electronic technology will require the integration of superconducting thin films with other materials, both as substrates and as interlayers. A list of the requirements that these other materials must satisfy is presented, and the relevant properties of various materials that are being studied for use in conjunction with high temperature superconductors is discussed. Finally, the current state of materials properties relevant to electronic applications and the prospects for progress in the areas needing improvement is presented.

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Authors and Affiliations

  1. AT&T Bell Laboratories, Murray Hill, NJ, 07974, USA

    Julia M. Phillips

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  1. Julia M. Phillips
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  1. Air Force Office of Scientific Research, Washington, DC, USA

    Harold Weinstock

  2. Lincoln Laboratory, Massachusetts Institute of Technology, Lexington, MA, USA

    Richard W. Ralston

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Phillips, J.M. (1993). Materials Issues Affecting the New Superconducting Electronics. In: Weinstock, H., Ralston, R.W. (eds) The New Superconducting Electronics. NATO ASI Series, vol 251. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-1918-4_3

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