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Solder Joint Reliability: Thermo-mechanical analysis on Power Flat Packages

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Advances on Mechanics, Design Engineering and Manufacturing

Part of the book series: Lecture Notes in Mechanical Engineering ((LNME))

Abstract

In the last decades the main focus for improvements in Power Electronics was mainly addressed on chip technology. Therefore, Power Electronic performance depends by a high ratio on package technologies and on their interconnections. In particular, the automotive industry has high requirements regarding cost efficiency, reliability and compactness. Increasing power densities, cost pressure and more stringent reliability target for modern power semiconductors are making thermal system optimization more and more important in relation to electrical optimization. This article will give an overview of the new methodological approach leaded by Finite Element (FE) simulation for new packages and interconnection solution ideas. A viscoplastic creep modelling is adopted for the solder taking into account time, temperature and stress dependences in Thermal Cycle. A parametric study is performed by changing geometrical solutions. The results obtained from the modelling has been used to form design guidelines that were also matched with experimental data.

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Authors and Affiliations

  1. Scuola Superiore di Catania, Università di Catania, via Valdisavoia 9, 95123, Catania, Italy

    Alessandro Sitta

  2. STMicroelectronics, Stradale Primosole 50, 95121, Catania, Italy

    Alessandro Sitta, Michele Calabretta, Marco Renna & Daniela Cavallaro

Authors
  1. Alessandro Sitta
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  2. Michele Calabretta
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  3. Marco Renna
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  4. Daniela Cavallaro
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Corresponding author

Correspondence to Alessandro Sitta .

Editor information

Editors and Affiliations

  1. Université de Technologie de Compiègne , Compiègne, France

    Benoit Eynard

  2. Dip di Ingegneria Chimica, Gest,Info,Mec, Università degli Studi di Palermo Dip di Ingegneria Chimica, Gest,Info,Mec, Palermo, Italy

    Vincenzo Nigrelli

  3. Dip di Ing, Elet, e Elet, Inform (DIEEI), Università degli Studi di Catania Dip di Ing, Elet, e Elet, Inform (DIEEI), Catania, Italy

    Salvatore Massimo Oliveri

  4. Camino De Vera S/N, Universidad Politecnica de Valencia Camino De Vera S/N, Valencia, Spain

    Guillermo Peris-Fajarnes

  5. Dept of Mechanical Energy and Management, University of Calabria Dept of Mechanical Energy and Management, Rende (Cosenza), Italy

    Sergio Rizzuti

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Sitta, A., Calabretta, M., Renna, M., Cavallaro, D. (2017). Solder Joint Reliability: Thermo-mechanical analysis on Power Flat Packages. In: Eynard, B., Nigrelli, V., Oliveri, S., Peris-Fajarnes, G., Rizzuti, S. (eds) Advances on Mechanics, Design Engineering and Manufacturing . Lecture Notes in Mechanical Engineering. Springer, Cham. https://doi.org/10.1007/978-3-319-45781-9_71

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  • DOI: https://doi.org/10.1007/978-3-319-45781-9_71

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  • Publisher Name: Springer, Cham

  • Print ISBN: 978-3-319-45780-2

  • Online ISBN: 978-3-319-45781-9

  • eBook Packages: EngineeringEngineering (R0)

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