Abstract
Nanopore sequencers for deoxyribonucleic acid (DNA) have attracted significant attention to achieve high speed analysis with lower cost. Translocation mechanisms of DNA through a nanopore are not only essential in polymer physics but also critical in single-molecule detection. We address the electrokinetic transport of single-stranded DNA (ssDNA) through a nanopore in the presence of external nonuniform electric fields. Herein, a long-chain DNA molecule is represented by a coarse-grained bead-spring model consisting of 400 beads connected with harmonic springs. Langevin dynamics simulations are performed to investigate the electrokinetic transport dynamics in solution. In the whole structure of a nanofluidic device consisting of microchannel, nanochannel, and nanopore, non-uniform electric fields are numerically analyzed by using the finite element method. Conformation changes of the DNA chain during the translocation process is analyzed and we can predict a waiting time of ssDNA at the entrance of nanochannel before entering a nanopore, which is of great interest but difficult to observe in experiments. Our simulation results are expected to provide useful information to design an advanced nanopore devices for DNA sequencing.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Preview
Unable to display preview. Download preview PDF.
Similar content being viewed by others
Author information
Authors and Affiliations
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 2014 Springer International Publishing Switzerland
About this paper
Cite this paper
Qian, W., Doi, K., Kawano, S. (2014). Langevin Dynamics Simulation of Single-Stranded DNA Translocation though Nanopore in External Non-uniform Electric Field. In: Goh, J. (eds) The 15th International Conference on Biomedical Engineering. IFMBE Proceedings, vol 43. Springer, Cham. https://doi.org/10.1007/978-3-319-02913-9_83
Download citation
DOI: https://doi.org/10.1007/978-3-319-02913-9_83
Publisher Name: Springer, Cham
Print ISBN: 978-3-319-02912-2
Online ISBN: 978-3-319-02913-9
eBook Packages: EngineeringEngineering (R0)