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UHV Deposition and In-Situ Analysis of Thin-Film Superconductors

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Advances in Cryogenic Engineering Materials

Part of the book series: Advances in Cryogenic Engineering ((ACRE,volume 32))

Abstract

The application of a UHV deposition and surface analysis facility to the fabrication of high-transition-temperature superconducting films for studies of epitaxial growth and development of refractory tunnel junctions is discussed. A description is given of the vacuum system with some detail of the chambers used for co-evaporation and reactive dc magnetron sputtering. Specific examples presented to illustrate the effect of MBE-like deposition conditions, and the role of RHEED, XPS, and, to a lesser extent, other surface-sensitive probes, are: (a) the preparation of clean and damage-free sapphire and Nb3Ir substrates, (b) the epitaxial relationships in a number of superconductor-insulator systems such as sapphire and NbN, Nb3Sn, and Mo-Re, (c) the development of CaF2 and ion-beam oxidized Al and Mg tunnel barriers, and (d) the deposition of refractory counterelectrodes. Correlations are made with tunneling characteristics for appropriate examples.

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Authors and Affiliations

  1. Westinghouse R&D Center, Pittsburgh, Pennsylvania, USA

    J. Talvacchio, M. A. Janocko, J. R. Gavaler & A. I. Braginski

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  1. J. Talvacchio
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  2. M. A. Janocko
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  3. J. R. Gavaler
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  4. A. I. Braginski
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Editors and Affiliations

  1. U.S. Department of Commerce, National Bureau of Standards, Boulder, Colorado, USA

    R. P. Reed  & A. F. Clark  & 

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© 1986 Plenum Press, New York

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Talvacchio, J., Janocko, M.A., Gavaler, J.R., Braginski, A.I. (1986). UHV Deposition and In-Situ Analysis of Thin-Film Superconductors. In: Reed, R.P., Clark, A.F. (eds) Advances in Cryogenic Engineering Materials . Advances in Cryogenic Engineering Materials , vol 32. Springer, Boston, MA. https://doi.org/10.1007/978-1-4613-9871-4_63

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  • DOI: https://doi.org/10.1007/978-1-4613-9871-4_63

  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-1-4613-9873-8

  • Online ISBN: 978-1-4613-9871-4

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