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Thermal and Power Delivery Challenges in 3D ICs

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Three Dimensional Integrated Circuit Design

Part of the book series: Integrated Circuits and Systems ((ICIR))

Abstract

Compared to their 2D counterparts, 3D integrated circuits provide the potential for tremendously increased levels of integration per unit footprint. While this property is attractive for many applications, it also creates more stringent design bottlenecks in the areas of thermal management and power delivery. First, due to increased integration, the amount of heat per unit footprint increases, resulting in the potential for higher on-chip temperatures. The task of thermal management must necessarily be shared both by the heat sink, which transfers internally generated heat to the ambient, and by using thermally conscious design methods. Second, the power to be delivered to a 3D chip, per package pin, is tremendously increased, leading to significant complications in the task of reliable power delivery. This chapter presents an overview of both of these problems and outlines solution schemes to overcome the corresponding bottlenecks.

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Authors and Affiliations

  1. Department of Electrical and Computer Engineering, University of Minnesota, Minneapolis, 55455, MN, USA

    Pulkit Jain, Pingqiang Zhou, Chris H. Kim & Sachin S. Sapatnekar

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  1. Pulkit Jain
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  2. Pingqiang Zhou
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  3. Chris H. Kim
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  4. Sachin S. Sapatnekar
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Correspondence to Pulkit Jain .

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Editors and Affiliations

  1. Dept. Computer Science & Engineering, Pennsylvania State University, University Park, 16802, U.S.A.

    Yuan Xie

  2. Dept. Computer Science, University of California, Los Angeles, Boelter Hall 4731, Los Angeles, 90095-1596, U.S.A.

    Jason Cong

  3. Institute of Technology, University of Minnesota, Union St. SE., 200, Minneapolis, 55455, U.S.A.

    Sachin Sapatnekar

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Jain, P., Zhou, P., Kim, C.H., Sapatnekar, S.S. (2010). Thermal and Power Delivery Challenges in 3D ICs. In: Xie, Y., Cong, J., Sapatnekar, S. (eds) Three Dimensional Integrated Circuit Design. Integrated Circuits and Systems. Springer, Boston, MA. https://doi.org/10.1007/978-1-4419-0784-4_3

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  • DOI: https://doi.org/10.1007/978-1-4419-0784-4_3

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