Copper electroplating is generally used for the fabrication of Large-Scale Integration (LSI) besides other methods such as sputtering because of its excellent via/trench filling ability, good adhesion and lower process temperature and cost. In the electroplating process, estimating a growth rate of electroplating in real-time is essential. It is possible to estimate a growth rate of electroplating from the current density on the LSI wafer surface because the rate mainly depends on the current density. In our previous research, applying inverse analysis methods, a new nondestructive method to monitor a growth rate of electroplating from the magnetic flux density outside the electroplating device measured by magnetic sensors was developed. In this paper, measurement experiments under several electroplating conditions are performed in order to verify the effectivity of this method. The growth rates of electroplating estimated by the method are compared with the thicknesses measured by the profilometer. Also the electric potentials in the electroplating device estimated by the method are compared with those measured by the electrometer. These results show that this method could be applicable to practical problems. In addition, we extend the method for an arbitrarily shaped electroplating device by applying FEM and BEM. We apply Tikhonov regularization to this method and develop a new determination procedure of the regularization parameter