Abstract
With the high demand and sub-nanometer design for integrated circuits, surface defect complexity and frequency for semiconductor wafers have increased; subsequently emphasizing the need for highly accurate fault detection and root-cause analysis systems as manual defect diagnosis is more time-intensive, and expensive. As such, machine learning and deep learning methods have been integrated to automated inspection systems for wafer map defect recognition and classification to enhance performance, overall yield, and cost-efficiency. Concurrent with algorithm and hardware advances, in particular the onset of neural networks like the convolutional neural network, the literature for wafer map defect detection exploded with new developments to address the limitations of data preprocessing, feature representation and extraction, and model learning strategies. This article aims to provide a comprehensive review on the advancement of machine learning and deep learning applications for wafer map defect recognition and classification. The defect recognition and classification methods are introduced and analyzed for discussion on their respective advantages, limitations, and scalability. The future challenges and trends of wafer map detection research are also presented.
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Acknowledgements
The work described in this paper was supported by Natural Sciences and Engineering Research Council of Canada (NSERC under grant RGPIN-217525). The authors are grateful for their support.
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This work was supported by Natural Sciences and Engineering Research Council of Canada (NSERC), Grant RGPIN-217525.
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Appendix
Appendix
Abbreviation | Term |
---|---|
AC | Adjacency Clustering |
AdaBalGAN | Adaptive Balancing Generative Adversarial Network |
AMI | Adjusted Mutual Information |
ANN | Artificial Neural Network |
ARI | Adjusted Rand Index |
BALD | Bayesian Active Learning by Disagreement |
BO | Bayesian Optimization |
BB | Bounding Box |
BPN | Back Propagation Network |
C2DPCA | Conditional Two-Dimensional PCA |
CCD | Charge-Coupled Devices |
CMP | Chemical Mechanical Process |
CNN | Convolutional Neural Network |
CPF | Connected-Path Filtering |
CVAE | Convolutional Variational Autoencoder |
CZ | Czochralski |
DBN | Deep Belief Network |
DBSCAN | Density-based Spatial Clustering of Applications with Noise |
DCN | Deformable Convolutional Network |
DCNN | Deep Convolutional Neural Network |
DDPfinder | Dominant Defective Patterns Finder |
DFS | Depth-first Search |
DL | Deep Learning |
DP | Dirichlet Process |
ECOC | Error-Correcting Output Codes |
EMR | Exact Match Ratio |
ESDAE | Enhanced Stacked Denoising Autoencoder |
EUV | Extreme Ultraviolet |
FAM | Fuzzy ARTMAP |
FD | Fischer-discriminant |
FZ | Float-zone |
GAN | Generative Adversarial Network |
GBM | Gradient Boosting Machine |
GMM | Gaussian Mixture Model |
GRN | Generalized Regression Network |
IC | Integrated Circuit |
IL | Incremental Learning |
ILT | Inverse-lithography Technology |
iWMM | Infinite Warped Mixture Model |
JLNLDA | Joint Local and Non-local Linear Discriminant Analysis |
kNN | k-Nearest Neighbors |
LDA | Linear Discriminant Analysis |
LLE | Locally Linear Embedding |
LR | Logistic Regression |
MDS | Multi-Dimensional Scaling |
MI | Mutual Information |
ML | Machine Learning |
MLP | Multi-Layer Perceptron |
MPre | Micro-Precision |
MRe | Micro-Recall |
NMI | Normalized Mutual Information |
OPTICS | Ordering Point to Identify the Cluster Structure |
PCA | Principal Component Analysis |
PCACAE | PCA-based Convolutional Autoencoder |
RCA | Root-cause Analysis |
RF | Random Forest |
RGRN | Randomized General Regression Network |
RI | Rand Index |
RL | Reinforcement Learning |
RNN | Recurrent Neural Network |
SAT | Scanning Acoustic Tomography |
SCSDAE | Stacked Convolutional Sparse Denoising Autoencoder |
SDAE | Stacked Denoising Autoencoder |
SEM | Scanning Electron Microscopy |
SS-CDGMM | Semi-supervised Convolutional Deep Generative Multiple Models |
SSD | Single Shot Detector |
SVAE | Semi-supervised Variational Autoencoder |
SVC | Support Vector Clustering |
SVE | Soft Voting Ensemble |
SVM | Support Vector Machine |
t-SNE | t-distributed Stochastic Neighbor Embedding |
TTV | Total Thickness Variation |
UV | Ultraviolet |
VAE | Variational Autoencoder |
WBM | Wafer Bin Map |
WM | Wafer Map |
WMDD | Wafer Map Defect Detection |
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Kim, T., Behdinan, K. Advances in machine learning and deep learning applications towards wafer map defect recognition and classification: a review. J Intell Manuf 34, 3215–3247 (2023). https://doi.org/10.1007/s10845-022-01994-1
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DOI: https://doi.org/10.1007/s10845-022-01994-1