hotSPICE

By Andrew Schwinke1; Timothy S Fisher1; Greg Walker2

1. Purdue University 2. Vanderbilt University

Linear thermal circuit simulation tool for both steady-state and transient problems

Launch Tool

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Archive Version 1.2
Published on 07 Nov 2011 All versions

doi:10.4231/D3C24QM7W cite this

This tool is closed source.

Category

Tools

Published on

Abstract

hotSPICE is a linear thermal circuit simulation tool. Resistors, capacitors, temperature sources and heat sources can be used in any combination to model thermal problems. Both steady-state and transient analyses can be performed. Plots can be generated for temperature at any node in the circuit, as well for heat transfer across any temperature source. hotSPICE is intended for undergraduate heat transfer students.

Powered by

hotSPICE is powered by SPICE3f4, which was developed by Laurence Nagel at the University of California at Berkeley, under the direction of Donald O. Peterson.

Credits

hotSPICE was developed at Purdue University in 2008 by Andrew Schwinke under the direction of Dr. Timothy Fisher.

References

Source code provided by: (2005), "Spice3f4," doi:10254/nanohub-r227.1.

Cite this work

Researchers should cite this work as follows:

  • Andrew Schwinke, Timothy S Fisher, Greg Walker (2014), "hotSPICE," https://nanohub.org/resources/hotspice. (DOI: 10.4231/D3C24QM7W).

    BibTex | EndNote

Tags

  1. NCN Group - Circuits
  2. NCN Group - Thermal Properties
  3. SPICE
  4. SPICE3F4
  5. thermal
  6. thermal circuit