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Impact response of an anti-plane crack in a FGPM bonded to a homogeneous piezoelectric strip

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Abstract

A finite crack under transient anti-plane shear loads in a functionally graded piezoelectric material (FGPM) bonded to a homogeneous piezoelectric strip is considered. It is assumed that the electroelastic material properties of the FGPM vary continuously according to exponential functions along the thickness of the strip, and that the two layered strips is under combined anti-plane shear mechanical and in-plane electrical impact loads. The analysis is conducted on the electrically unified crack boundary condition. Laplace and Fourier transforms are used to reduce the mixed boundary value problems to Fredholm integral equations of the second kind in the Laplace transform domain. Then, a numerical Laplace inversion is performed and the dynamic intensities are obtained as functions of time and geometric parameters, which are displayed graphically.

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Kwon, S.M. Impact response of an anti-plane crack in a FGPM bonded to a homogeneous piezoelectric strip. International Journal of Fracture 123, 187–208 (2003). https://doi.org/10.1023/B:FRAC.0000007377.73716.34

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  • DOI: https://doi.org/10.1023/B:FRAC.0000007377.73716.34

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