Elsevier

Thin Solid Films

Volume 247, Issue 2, 15 July 1994, Pages 148-150
Thin Solid Films

Letter
Direct formation of CuTCNQ complex salts with dual deposition

https://doi.org/10.1016/0040-6090(94)90791-9Get rights and content

Abstract

Copper and 7,7,8,8-tetracyanoquinodimethane (TCNQ) were evaporated towards a substrate, a glass plate coated with 100 nm thick Au, at a temperature of 250 K. The deposited film was analyzed with refractive absorption spectroscopy-FTIR. The absorption spectrum was similar to that of the CuTCNQ complex salt synthesized by dipping the copper plate into a solution of TCNQ in acetonitrile. The degree of charge transfer from copper to TCNQ in the dual deposition film was 0.4 while that in the synthesized Cu TCNQ was 0.6.

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Cited by (10)

  • Electrosynthesis of Copper-Tetracyanoquinodimethane Based on the Coupling Charge Transfer across Water/1,2-Dichloroethane Interface

    2014, Electrochimica Acta
    Citation Excerpt :

    A “spontaneous electrolysis” mechanism is considered as a localized corrosion-crystallization process in which metallic Cu is oxidized into Cu+ cations and TCNQ reduced into TCNQ●− anion radicals before precipitation to form CuTCNQ [1,9–14]. Alternatively, CuTCNQ can be prepared through dry procedures, including the alternative vapor deposition of Cu and TCNQ multilayers [4,11,15], thermal codeposition of Cu and TCNQ [16,17], and reaction between the Cu substrate with TCNQ vapor [18,19]. Moreover, with the help of lithographic techniques, micropatterns with nanostructured CuTCNQ can be obtained which is valuable for the fabrication of microdevices [15,20].

  • Solution growth of metal-organic complex CuTCNQ in small dimension interconnect structures

    2010, Journal of Crystal Growth
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    Although CuTCNQ can be prepared by several methods (e.g. reaction of Cu with a TCNQ solution [5,12]; reaction of Cu with TCNQ gas [4,7,13–15]; coevaporation [8,16]; photocrystallization [17] and electrochemical methods [18–20]), routinely applied fabrication technologies in microelectronics such as vapor deposition and spin coating are not suitable to CuTCNQ complex [7]. Besides the fact that the material thermally decomposes before evaporating [21] and its extremely low solubility in solvents prevents spin coating, such methods would also require an additional lithographical patterning step of the organic compound, which is – in contrast to most inorganic materials – quite sensitive to chemicals. The same issue would also hold in the case of chemical vapor deposition of CuTCNQ, for which no process was described to the best of our knowledge.

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