ABSTRACT
Thermal effects are becoming increasingly important in today's sub-micron technologies. Thermal issues affect the performance, the reliability and the cooling costs of integrated systems. High peak temperatures are of major concern in modern 3D designs, where the stacking of multiple layers leads to higher power densities. Therefore, the integration of the thermal-aware design during the initial phases of the design can reduce the cost and the time-to-market of the resulting product. An efficient floorplanning in terms of thermal effects will reduce the appearance of critical hotspots and will spread heat across the chip area.
This paper analyzes the thermal distribution of 3D multicore architectures and provides a motivation for the need of a thermal-aware floorplanner for such architectures.
- Yeh, L. T. and Chu, R. C. (2002) Thermal Management of Microelectronic Equipment. American Society of Mechanical Engineers.Google Scholar
- Srinivasan, J. et al. (2004) The impact of technology scaling on lifetime reliability. DSN 177. Google ScholarDigital Library
- Atienza, D. et al. (2007) HW-SW emulation framework for temperature-aware design in MPSoCs. ACM Trans. Des. Autom. Electron. Syst., 12, 1--26. Google ScholarDigital Library
- Sherwani, N. A. (1999) Algorithms for VLSI Physical Design Automation. Kluwer Academic Publishers. Google ScholarDigital Library
- Ekpanyapong, M. et al. (2004) Profile-guided microarchitectural floorplanning for deep submicron processor design. DAC, pp. 634--639. Google ScholarDigital Library
- Cong, J. et al. (2003) Microarchitecture evaluation with physical planning. DAC, pp. 32--35. Google ScholarDigital Library
- Kaya, I., Olbrich, M., and Barke, E. (2003) 3-d placement considering vertical interconnects. SOC, Sept., pp. 257--258.Google Scholar
- Hung, W.-L. et al. (2006) Interconnect and thermal-aware floorplanning for 3d microprocessors. ISQED, pp. 98--104. Google ScholarDigital Library
- Gu, Z. P. et al. (2006) Taphs: thermal-aware unified physical-level and high-level synthesis. ASP-DAC, pp. 879--885. Google ScholarDigital Library
- Goplen, B. and Sapatnekar, S. (2003) Efficient thermal placement of standard cells in 3d ics using a force directed approach. ICCAD 86. Google ScholarDigital Library
- Mukherjee, R., Ogrenci Memik, S., and Memik, G. (2005) Temperature-aware resource allocation and binding in high-level synthesis. DAC, June, pp. 196--201. Google ScholarDigital Library
- Sankaranarayanan, K. et al. (2005) A case for thermal-aware floorplanning at the microarchitectural level. Journal of Instruction-Level Parallelism, 8, 1--16.Google Scholar
- Mogal, H. D. and Bazargan, K. (2008) Thermal-aware floorplanning for task migration enabled active sub-threshold leakage reduction. ICCAD, pp. 302--305. Google ScholarDigital Library
- Ayala, J. L. et al. (2009) Through Silicon Via-Based Grid for Thermal Control in 3D Chips. Nano-Net, Lecture Notes in Computer Science, 1, pp. 1--7. Springer.Google Scholar
- Mulas, F., Pittau, M., Buttu, M., Carta, S., Acquaviva, A., Benini, L., and Atienza, D. (2008) Thermal balancing policy for streaming computing on multiprocessor architectures. DATE08, pp. 734--739. Google ScholarDigital Library
Index Terms
- Thermal-aware floorplanning exploration for 3D multi-core architectures
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