論文摘要 IC承載盤(IC Tray)在IC後段流程上是具重要性的承載容器,晶圓(Wafer)封裝成IC後,挑出IC放置在IC承載盤上,依其製程需求作業,最後再將挑出的IC,依客戶的規範進行外觀檢查,將承載盤放置於客戶要求的包材中,包裝成品出貨,較常用的IC Tray區分為耐溫140℃及150℃二種。 在新產品導入時,會要求要先確認客戶使用的Tray,避免上線生產時才發現客戶使用的Tray無法在公司內的設備中使用。若客戶使用特殊的Tray,在測試製程中,可能需要更換不同的機構或增加換Tray的製程站,造成成本浪費。承接監管系統統合業務時,往往封裝和測試是分開進行,但往往忽略『標準Tray』是貫穿整個製程的重要性。
Abstract IC trays are the most importance material in IC backend process. When wafer be assembled as IC, those IC will be picked into trays. Then operator will perform inspect follow the specification of customer. Finally, them will be packed & shipped as customer requirement. Tray to differentiate between 140℃ & 150℃。 The tray will be confirmed to avoid can’t running on handler equipment at new IC pilot run period .If customer create a special tray dimension, the testing house maybe change or modify their kit in testing. process which will cause increase cost. In turnkey business, assembly and testing are separated by different processes, so the standard tray are important packing material to through assembly and testing process, but them often be neglected.