High effective thermal conductivity element such as heatpipes, vapor chambers are major thermal solution technologies in Industry. The main purpose of this study is to investigate the permeability and the effective pore radius by conducting capillary-rise experiments. Recently, a variety of high-tech merchandise were so designed to achieve ultra-light, extremely thin and high processing performance. Therefore, the traditional vapor chambers are gradually losing their markets, especially in the mobile industry because only the thinnest vapor chamber meets the demands of the market. However, the spatial design inside the thin structure of vapor chamber is a critical problem. Hence, how to manufacture a vapor chamber with tiny volume and high-quality capillary force has become a challenge in both technical design and mass production. There are three significant factors involved with the performance of vapor chambers: 1. the ratio of fluid merit - in general the DI-water is used in order to keep the cost down. 2. the ratio of permeability and effective pore radius (a), and 3. the geometric structures of the vapor chamber. For the sake of comparing the ability of capillary performance, this study is divided into two experiments. In the first place, we set up a system to measure the parameter of capillary performance . Secondly we measure the contact angle (theta) of a vapor chamber. As a result, the contact angle decreases as the capillary performance increases and vice versa . Currently most of the industries are using 200 mesh copper in the vapor chamber. In this study, we design the various wick types on 200 mesh copper. We found that the best capillary performance occurs at 50% wick type for a single layer, which is even better than the bilayer mesh copper. In a vapor chamber, the wick structure's performance increases while the frictional loss increases as well. Hence, it is worwhile to find the appropriate parameters, which balances/optimizes the wicks design, aiming to enhance the overall performance of a vapor chamber.