Environmentally Benign In-Line Cleaning Solutions for Immersion Lithography Tools

Tian Niu Chen; Michael B. Korzenski; Steve Bilodeau; Peng Zhang; Todd Hogan; Kim van Berkel; George Mirth; Rebecca Mih; Kornel Hoekerd; Bauke Jansen; Rik Vangheluwe; Nadja Schuh

doi:10.4028/www.scientific.net/SSP.187.307

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HomeSolid State PhenomenaSolid State Phenomena Vol. 187Environmentally Benign In-Line Cleaning Solutions...

Environmentally Benign In-Line Cleaning Solutions for Immersion Lithography Tools

Abstract:

A pH neutral formulation 3x to perform the in-line cleaning of resists/topcoats contaminated immersion assembly efficiently and effectively has been developed. It is environmentally benign with no halides, no individual component having a flash point above 38°C or known to cause cancer, birth defects or other reproductive harm.

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Periodical:

Solid State Phenomena (Volume 187)

Pages:

307-310

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.187.307

Citation:

Cite this paper

Online since:

April 2012

Authors:

Tian Niu Chen, Michael B. Korzenski, Steve Bilodeau, Peng Zhang, Todd Hogan, Kim van Berkel, George Mirth, Rebecca Mih, Kornel Hoekerd, Bauke Jansen, Rik Vangheluwe, Nadja Schuh

Keywords:

Combinatorial, Defectivity, Immersion, In-Line Cleaning

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