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HomeMaterials Science ForumMaterials Science Forum Vol. 891Microstructure and Crack Propagation of...

Microstructure and Crack Propagation of Electrically Conductive SiC Based Composites

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Abstract:

The work deals with the observation of microstructure and crack propagation from macro-indentation in a set of newly developed materials. Complex composites based on SiC matrix with 30, 40 and 50 wt. % of additives (Ti and NbC) were hot pressed at 1960 oC in air atmosphere under 30 MPa pressure for 1.5 hour. The microstructure and chemical composition were studied by SEM equipped with EDX analyzer. Hardness of the composites was evaluated by means of classic Vickers macro-indentation and fracture toughness was determined by the Anstis method. Indentation cracks were observed and their propagation was analyzed. The electrical conductivity as function of volume fraction of additives was determined.

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Metallography XVI

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Periodical:

Materials Science Forum (Volume 891)

Pages:

547-551

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.891.547

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Online since:

March 2017

Authors:

Martin Fides*, Pavol Hvizdoš, Róbert Džunda, Roman Bystrický, Jaroslav Sedláček

Keywords:

Composite, Crack Propagation, Electric Conductivity, Hardness, Indentation, Silicon Carbide

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* - Corresponding Author

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