Study on the Characteristics of Discharge Waveform in Micro EDM Deposition Process

Zi Long Peng; Yi Nan Li; Z.L. Wang

doi:10.4028/www.scientific.net/MSF.697-698.187

Paper Titles

An Experimental Study of Radial-Mode Abrasive Waterjet Turning of Steels
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Effect of EDM Conditions on Surface Residual Stress of Cr12MoV Steel
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Finite Element Analysis and Optimization of Structure for Large Blanking Machine Equipment during High-Speed Blanking
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Study on Micro Growth Process and Characteristics of Deposited Material in Micro EDM Deposition
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Study on the Characteristics of Discharge Waveform in Micro EDM Deposition Process
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Molecular Dynamics Simulation of Al₂O₃-SiC Interface
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Cutting Temperature Investigation when High-Speed Milling of SiC_P/Al Composites
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An Explicit Integration Algorithm for Introducing User-Defined Thermo-Viscoplastic Constitutive Models in FE Simulations
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Effect of Cutting Speed on Surface Integrity in High Speed Machining Nickel-Based Superalloy Inconel 718
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Study on the Characteristics of Discharge Waveform in Micro EDM Deposition Process

Abstract:

Based on the analysis of micro electrical discharge machining (micro EDM) principle, the process conditions of micro EDM deposition has been obtained. Micro EDM deposition is a new EDM method, in which the process conditions includes selecting air as working medium, short pulse duration, long pulse interval, low discharge current and setting the tool electrode as anode. In micro EDM deposition experiments, two types pulse generators of transistor type and RC type are applied respectively. The characteristics of discharge waveforms using each type pulse generator are researched. Results show that both two types pulse generators can be applied in the micro EDM deposition process. The transistor type is easy to obtain the same single discharge energy, but short circuit will damage the deposited material. While RC type can adjust discharge energy according to the discharge gap state, which is well used in micro EDM deposition process with the high deposition rate.