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HomeMaterials Science ForumMaterials Science Forum Vol. 1002Thermal Conductivity Optimization of Porous...

Thermal Conductivity Optimization of Porous Alumina Ceramics via Taguchi Model

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Abstract:

A comparative analysis of the thermal conductivity for porous alumina using Taguchi method has been reported in the current research. Porous alumina is one of the most critical ceramics amongst those that are widely used in the thermal insulator industry; this is because of their physical properties. Thus, the investigation of these properties is highly desirable. Test variables were performed for the thermal conductivity studies-weight per cent of a pore-forming agent (yeast), sintering temperature, and soaking time. Through implementing the experimental design using the Taguchi method for thermal conductivity of porous alumina was statistically analyzed. The Signal-to-noise ratio and variance analysis investigated the influence of different parameters on the porous media's thermal conductivity. The result of research determines that the addition of the pore-forming agent obtained a higher thermal insulator. Based on the optimum conditions obtained from the Taguchi method factor was 20wt.% weight of yeast cell , sintering temperature at 1200 C , and the holding time 1.5 h. that give higher value of the S/N ratio.

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Periodical:

Materials Science Forum (Volume 1002)

Pages:

125-131

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.1002.125

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Online since:

July 2020

Authors:

Mohsin A. Aswad, Amir N. Saud*, Mohammed A. Ahmed

Keywords:

Porous Alumina, Taguchi Technique, Thermal Conductivity

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