Combined Diamond Disks in Chemical Mechanical Polishing

Ming Yi Tsai; J.K. Ho; Jyu Lin Zeng

doi:10.4028/www.scientific.net/KEM.642.110

Paper Titles

Numerical Simulation on Variable Load EHL Problems with Single Asperities
p.89

Surface Modification of Ultra-High Molecular Weight Polyethylene with Crosslinked Hyaluronic Acid and its Antiwear Performance
p.94

Tribological Characteristics of Silicon Nitride Ceramic in Three Water-Based Lubricants
p.99

Effects of Surface Forces on Pure Squeeze Elastohydrodynamic Lubrication Motion of Circular Contacts with Coated Layer
p.104

Combined Diamond Disks in Chemical Mechanical Polishing
p.110

Experimentally Investigate the Vortex Ferro-Viscosity under Directional Field
p.115

Thermal Effects of Mechanical Polishing and Conditioning on Polishing Pads
p.120

The Friction and Wear of Silicon Nitride Ceramic with BSA Lubricant
p.125

Effects of Aluminum Content on Oxidation Behavior of W-Al Nanolayer Coatings
p.130

HomeKey Engineering MaterialsKey Engineering Materials Vol. 642Combined Diamond Disks in Chemical Mechanical...

Combined Diamond Disks in Chemical Mechanical Polishing

Abstract:

This paper presents a combined diamond disk that is designed and manufactured to markedly improve the leveling of diamond tips, thereby reducing the amount of diamond grit. First, a small brazed diamond disk was manufactured. Second, 12-or 24-disk brazed diamond disks were mounted onto a substrate with a diameter of 108 mm for completing the combined diamond disk. Four types of disks were fabricated, and their performances were compared with that of a conventional diamond disk. The experimental results showed that the combined diamond disk has more complete diamond crystal shapes and distribution with better leveling, which increases the effectiveness of the working diamond grits. Compared to a conventional diamond disk, the combined diamond disk achieved a higher wafer removal rate and better uniformity while consuming less pad material. The number of diamond grits required was significantly lower. Roughly, 7,600 and 12,000 diamond grits were used for the 24-and 12-disk brazed diamond disks, respectively, in the new disk, whereas 20,000 diamond grits were used in a conventional diamond disk. In the case of the conventional diamond disk, the diamond tips are leveled to more than 50 μm. However, in the case of the combined diamond disk, the diamond tips can be leveled to less than 30 μm because the diamond tips are already leveled. These results contribute to the understanding of conditioning techniques and further improvement of the chemical mechanical polishing process.

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Periodical:

Key Engineering Materials (Volume 642)

Pages:

110-114

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.642.110

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Online since:

April 2015

Authors:

Ming Yi Tsai*, J.K. Ho, Jyu Lin Zeng

Keywords:

CMP, Diamond Conditioner, Diamond Crystal Shape, Wafer Polishing Rate

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* - Corresponding Author

References

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