Chemical Mechanical Polishing of Transparent Nd:YAG Ceramics

Jun Li; Yong Zhu; Chuang Tian Chen

doi:10.4028/www.scientific.net/KEM.375-376.278

Paper Titles

Research on the Force Characteristics in Ultrasonic Grinding Nano-Zirconia Ceramics
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Material Removal Rate Characteristics in Ultrasonic Aided Lapping of Engineering Ceramics Based on Single-Point Scratch
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Experimental Investigation on Ultrasonic Face Machining of Glass with Free Abrasives
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Optics Manufacturing Using Magnetorheological Finishing
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Chemical Mechanical Polishing of Transparent Nd:YAG Ceramics
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Research on Chemical Mechanical Polishing for Silicon Nitride Ceramics
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The Molding Study of Polyimide Polishing Film
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Effects of Conditioning Parameters on Pad Performances
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Fabrication of Cylindrical Tungsten Microelectrode by Electrical Machining
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HomeKey Engineering MaterialsKey Engineering Materials Vols. 375-376Chemical Mechanical Polishing of Transparent...

Chemical Mechanical Polishing of Transparent Nd:YAG Ceramics

Abstract:

Transparent Nd:YAG ceramics which are very hard and brittle materials, are very difficult to be polished. There are many micro scratches or damages on the surface after mechanical polishing with Al2O3. In order to remove micro scratches or damages, chemical mechanical polishing (CMP) was adopted to manufacture Nd:YAG ceramics. In the polishing experiment, Pellon and Chemcloth pads were utilized for chemical mechanical polishing of Nd:YAG ceramics. Colloidal SiO2 was selected as the polishing slurry in two different polishing environments, acidity and alkalinity. The surface roughness was determined by using atomic force microscope. In this study, four polishing experimental combinations that each combination contains one of the two pads and one of the two polishing environments were carried out in the optimum polishing condition. Then the high quality surface of transparent Nd:YAG ceramics with the best surface roughness of < 0.2 nm RMS and few micro scratches or damages is obtained by adopting CMP process with Chemcloth pad and colloidal SiO2 in acidic condition.

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Periodical:

Key Engineering Materials (Volumes 375-376)

Pages:

278-282

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.375-376.278

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Online since:

March 2008

Authors:

Jun Li, Yong Zhu, Chuang Tian Chen

Keywords:

Chemical Mechanical Polishing (CMP), Colloidal Silica (SiO₂), Nd:YAG Ceramics, Polishing Pad, Surface Roughness (SR)

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