Effect of Sintering Temperature on Silver-Copper Nanopaste as High Temperature Die Attach Material

Kim Seah Tan; Kuan Yew Cheong

doi:10.4028/www.scientific.net/AMR.795.47

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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 795Effect of Sintering Temperature on Silver-Copper...

Effect of Sintering Temperature on Silver-Copper Nanopaste as High Temperature Die Attach Material

Abstract:

A novel stencil-printable silver-copper (Ag-Cu) nanopaste that serves as an alternative high temperature die attach material was introduced in this study. The nanopaste was made by mixing 50 nm-sized of Ag and Cu particles with an organic binder system. Sintering temperatures, up to 450°C, were used to sinter nanopaste in air and its post sintered properties were investigated. The viscosity of nanopaste was 350,000 cps and it demonstrated a shear thinning behavior. Scanning electron microscope revealed the change of grain structure with the change in the sintering temperature. Formations of Ag₉₇Cu₃ and Ag₁Cu₉₉ compounds after sintering were confirmed with X-ray diffraction; and the electrical conductivity of the sintered nanopaste was increased with the increase of the sintering temperature. The study concluded 380°C was the optimum sintering temperature to form a well sintered nanopaste.

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Periodical:

Advanced Materials Research (Volume 795)

Pages:

47-50

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.795.47

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Cite this paper

Online since:

September 2013

Authors:

Kim Seah Tan, Kuan Yew Cheong

Keywords:

Copper, Die Attach, High Temperature Applications, Lead-Free Solder, Silver, Sintering

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