Material Removal and Application by Chemical Impact Reaction in Nano-Abrasive Jet Polishing

Wen Qiang Peng; Sheng Yi Li; Chao Liang Guan; Xin Min Shen

doi:10.4028/www.scientific.net/AMR.631-632.550

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 631-632Material Removal and Application by Chemical...

Material Removal and Application by Chemical Impact Reaction in Nano-Abrasive Jet Polishing

Abstract:

Material removed by mechanical process inevitably causes surface or subsurface damage containing cracks, plastic scratch, residual stress or dislocations. In nano-abrasive jet polishing (NAJP) the material is removed by chemical impact reaction. The chemical impact reaction is validated by contrast experiment with traditional lap polishing process in which the material is mainly removed through mechanical process. Experiment results show the dependence of the abrasive particles on the choice of materials. Even if the abrasive particle and the workpiece are composed of similar components, the machining properties are remarkably different due to slight differences in their physical properties or crystallography etc. Plastic scratches on the sample which was polished by the traditional mechanical process are completely removed by NAJP process, and the surface root-square-mean roughness has decreased from 1.403nm to 0.611nm. The NAJP process will become a promising method for ultra precision machining method for ultrasmooth optical surface.

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Periodical:

Advanced Materials Research (Volumes 631-632)

Pages:

550-555

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.631-632.550

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Online since:

January 2013

Authors:

Wen Qiang Peng, Sheng Yi Li, Chao Liang Guan, Xin Min Shen

Keywords:

Bond Energy, Chemical Impact Reaction, Material Removal, Mechanical Process, Nano-Abrasive

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References

[1] Brinksmeier E., Lucca D. A. and Walter A., Chemical aspects of machining process, Annals of CIRP. 53 (2004)685-699.

DOI: 10.1016/s0007-8506(07)60035-3

Google Scholar

[2] Akihisa Kubota, Hidekazu Mimura, Kouji Inagaki, et al, Preparation of Ultrasmooth and Defect-Free 4H-SiC(0001) Surfaces by Elastic Emission Machining, Journal of Electronic Materials. 34(2005)439-443.

DOI: 10.1007/s11664-005-0124-3

Google Scholar

[3] Libo Zhoua, Takeshi Shiina, Zhongjun Qiu, et al, Research on chemo-mechanical grinding of large size quartz glass substrate, Precision Engineering. 33 (2009)499–504.

DOI: 10.1016/j.precisioneng.2009.01.006

Google Scholar

[4] Y. Mori, K. Yamauchi and K. Endo, Elastic emission machining, Precision Engineering. 9(1987)123–128.

DOI: 10.1016/0141-6359(87)90029-8

Google Scholar

[5] Y. Mori, K. Yamauchi and K. Endo, Mechanism of atomic removal in elastic emission machining, Precision Engineering. 10(1988)24–28.

DOI: 10.1016/0141-6359(88)90091-8

Google Scholar

[6] Feihu Zhang, Xiaozong Song, Yong Zhang and Dianrong Luan, Figuring of an ultra-smooth surface in nanoparticle colloid jet machining, Journal of Micromechanics and Microengineering. 19(2009)1-7.

DOI: 10.1088/0960-1317/19/5/054009

Google Scholar

[7] Elam A. Leed, Carlo G. Pantano, Computer modeling of water adsorption on silica and silicate glass fracture surfaces, Journal of Non-Crystalline Solids. 325 (2003)48–60.

DOI: 10.1016/s0022-3093(03)00361-2

Google Scholar

[8] Zahra Ranjbar, Saeed Rastegar, The influence of surface chemistry of nano-silica on microstructure, optical and mechanical properties of the nano-silica containing clear-coats, Progress in Organic Coatings. 65(2009)125–130.

DOI: 10.1016/j.porgcoat.2008.10.006

Google Scholar

[9] Kazuto Yamauchi, Kikuji Hirose, Hidekazu Goto, et al, First-principles simulations of removal process in EEM, Computational Materials Science. 14 (1999)232-235.

DOI: 10.1016/s0927-0256(98)00112-8

Google Scholar

[10] Yuzo Mori, Kazuto Yamauchi, Kikuji Hirose, et al, Numerically Controlled EEM (Elastic Emission Machining) System for Ultraprecision Figuring and Smoothing of Aspherical Surfaces, Crystal Growth Technology. 93(2003) 607-620.

DOI: 10.1002/0470871687.ch27

Google Scholar

[11] Yuzo Mori, Kazuya Yamamura, Katsuyoshi Endoa, et al, Creation of perfect surfaces, Journal of Crystal Growth. 275(2005)39–50.

Google Scholar

[12] Su Ying, Zhou Yongheng Huang Wu, Gu Zhenan, study on reaction kinetics between silica glasses and hydrofluoric acid, Journal of the Chinese Ceramic Society. 32(2004)287-296.

Google Scholar

[13] Lu Dan, X. L. Wu, Optical emission from SiOx(x=1. 2–1. 6) nanoparticles irradiated by ultraviolet ozone, Journal of Applied Physics. 94(2003)7288-7290.

DOI: 10.1063/1.1626797

Google Scholar