Copper Ultrasonic-Electrodeposition on Zn Alloy in Alkaline Bath Containing 1-Hydroxyethylene-1,1-Diphosphonic Acid

Jing Wu Zheng; Dan Li; Yao Ying; Liang Qiao; Li Qiang Jiang; Cheng Zhang

doi:10.4028/www.scientific.net/AMR.472-475.251

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 472-475Copper Ultrasonic-Electrodeposition on Zn Alloy in...

Copper Ultrasonic-Electrodeposition on Zn Alloy in Alkaline Bath Containing 1-Hydroxyethylene-1,1-Diphosphonic Acid

Abstract:

Zn alloy die casting is easily corroded and porous, so it is hard to obtain the strong adhesion strength between the substrate and the metal coating. In this paper, Cu coatings were prepared by ultrasonic-electrodeposition on Zn alloy in a cyanide-free deposition bath containing a base agent of 1-hydroxyethylene-1, 1-diphosphonic acid (HEDPA). The effect of ultrasound on the electrochemical behavior of bath and the morphology of the coating were investigated by potential sweep and by SEM, respectively. Experimental results indicate that pre-treatments, such as electrolytic degreasing, have a remarkable influence on adhesion strength. Application of ultrasonic increases the limiting current density of cathode and enhances the throwing power of bath. Application of ultrasonic also promotes the formation of network-cross copper coating which enhances the adhesion strength between the substrate and the coating.

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Advanced Manufacturing Technology, ICMSE 2012

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Periodical:

Advanced Materials Research (Volumes 472-475)

Pages:

251-255

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.472-475.251

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Online since:

February 2012

Authors:

Jing Wu Zheng, Dan Li, Yao Ying, Liang Qiao, Li Qiang Jiang, Cheng Zhang

Keywords:

1-Hydroxyethylene-1 1-Diphosphonic Acid, Cu Electrodeposition, Ultrasonic, Zn Alloy

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