Design of the Liquid-Cooling System for High Power LED Modules Using Taguchi Analysis

San Shan Hung; Hsing Cheng Chang; Chan Ming Liang

doi:10.4028/www.scientific.net/AMR.383-390.6416

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 383-390Design of the Liquid-Cooling System for High Power...

Design of the Liquid-Cooling System for High Power LED Modules Using Taguchi Analysis

Abstract:

To optimize thermal dissipation efficiency for cooling high power LED modules is studied and analyzed using ANSYS CFX software and Taguchi method. In liquid-cooling system, four control factors are tested and compared in order to find the best cooling arrangement that are pump flow rate, fan power, cooling liquid type and k- value of thermal compound. The experimental results show that the importance of these cooling parameters applied to high power LED module are k-value of thermal compound, fan power, liquid type and pump flow rate in sequence. For a constant heating power of 90W from an LED lighting module, an optimal thermal resistance of 0.563K/W is obtained that shows a significant improved result then the conventional LED module’s. It has high potential in future high power LED applications.

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Periodical:

Advanced Materials Research (Volumes 383-390)

Pages:

6416-6421

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.383-390.6416

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Online since:

November 2011

Authors:

San Shan Hung, Hsing Cheng Chang, Chan Ming Liang

Keywords:

Control Factors, Cooling Liquid Systems, High Power LED, Taguchi Method

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