New Planar Disc Transient Method for the Measurement of Thermal Properties of Materials

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Abstract:

Recently the physical model for the temperature field generated by thermophysical single-probe sensor in a shape of planar disc has been derived. The model accounts cylindrical sample having final radius and infinite length. The prototype of measuring electronics RTA was build that operates with auto balancing bridge. For the measurements the single-transition method is used. While the measurement error of the temperature response measured by thermocouple was 1% at the height of temperature response 1°C, the sensitivity of the measurement with the automatically balanced bridge is better and the signal to noise ratio is improved about 10 times. The measuring electronics was tested for measuring the temperature response using a single-sensor. This sensor generates the heat pulse and sense the temperature response in the same time. The next advantage is that the temperature response to the generated step-wise pulse is much smaller and it can be reduced to the level of 1-8° C compared to stationary method like guarded hot plate method. The effect of the temperature field generated by the probe is much smaller, which in the case of measurement of porous materials at the presence of moisture is beneficial, as the resulting redistribution of moisture under the created temperature gradient is negligible. There were derived basic models for the evaluation of this type of experiment. The probe should be in form of full cylinder or an annulus. The derived temperature function counts the outer and inner diameter of annulus. Putting the inner radius to zero we get the solution for full circle probe, so the model is universal. The model counts also the heat losses from the outer surface of the sample, when the time of measurement exceed the time when the penetration depth of generated heat pulse rich the outer radius of sample. The estimated output parameters from single measurement are the thermal conductivity, thermal diffusivity and specific heat. The heat transfer coefficient is additional parameter fitted as free parameter of the model.

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16-21

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October 2015

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