Heat Sink Cooling Fan and Rotation Speed Effect Analysis on Heat Dissipation of High Power GaN LED Package

Rajendaran Vairavan; Vithyacharan Retnasamy; Zaliman Sauli; Hussin Kamarudin; Muammar Mohamad Isa; Steven Taniselass

doi:10.4028/www.scientific.net/AMR.1082.315

Paper Titles

Experimental Investigation on Viscosities of Cu-H₂O Nanofluids
p.293

Experimental Investigation on Surface Tension of Water-Based Graphene Oxide Nanofluids
p.297

Steady State Thermal Behaviour of Ceramic Wick Structure for Application in Two Phase Heat Transfer Devices
p.302

Metallic Mesh as Capillary Structure Applied in Heat Pipe Heat Exchanger for Heat Recovery
p.309

Heat Sink Cooling Fan and Rotation Speed Effect Analysis on Heat Dissipation of High Power GaN LED Package
p.315

Heat Slug Material Variation Analysis on Thermal Dissipation of High Power LED
p.319

Thermal Stress Comparison on Copper and Gold Wire Bonded on Aluminium Bondpad
p.323

Application of Different Conductive Substrate Materials for Heat Transfer Enhancement in Cooling of Electronic Components
p.327

Thermal Simulation Analysis of High Power LED with Varied Heat Sink Fin Design
p.332

HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 1082Heat Sink Cooling Fan and Rotation Speed Effect...

Heat Sink Cooling Fan and Rotation Speed Effect Analysis on Heat Dissipation of High Power GaN LED Package

Abstract:

In this work, thermal simulation analysis on high power LED is reported where the effect of the heat sink cooling fan and its rotation speed on the heat dissipation of the high power LED was evaluated. Ansys version 11 was utilized for the simulation. The thermal performance of the high power LED package was assessed in terms of operating junction temperature, von Mises stress and thermal resistance. The heat dissipation analysis was done under four types of convection condition:one natural convection conditionthree forced convection condition,. The forced convection condition was used to replicate the effect of a fan with various rotation speeds placed under the heat sink to increase the convective heat transfer coefficient. Results of the analysis showed that that the junction temperature, von Mises stress and thermal resistance of the GaN chip reduces with the increase of the fan rotation speed.

You might also be interested in these eBooks

Advanced Materials and Engineering Materials IV

View Preview

Info:

Periodical:

Advanced Materials Research (Volume 1082)

Pages:

315-318

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.1082.315

Citation:

Cite this paper

Online since:

December 2014

Authors:

Rajendaran Vairavan, Vithyacharan Retnasamy*, Zaliman Sauli, Hussin Kamarudin, Muammar Mohamad Isa, Steven Taniselass

Keywords:

ANSYS, Cooling Fan, High Power LED, Junction Temperature

Export:

RIS, BibTeX

Price:

Permissions:

Request Permissions

* - Corresponding Author

References

[1] I. Y. Chen, M. -Z. Guo, K. -S. Yang, and C. -C. Wang, Enhanced cooling for LED lighting using ionic wind, International Journal of Heat and Mass Transfer, vol. 57, pp.285-291, (2013).

DOI: 10.1016/j.ijheatmasstransfer.2012.10.015

Google Scholar

[2] M. Dal Lago, M. Meneghini, N. Trivellin, G. Mura, M. Vanzi, G. Meneghesso, and E. Zanoni, Phosphors for LED-based light sources: Thermal properties and reliability issues, Microelectronics Reliability, vol. 52, pp.2164-2167, (2012).

DOI: 10.1016/j.microrel.2012.06.036

Google Scholar

[3] Z. Chen, Q. Zhang, R. Chen, F. Jiao, M. Chen, X. Luo, and S. Liu, Comparison of LED package reliability under thermal cycling and thermal shock conditions by experimental testing and finite element simulation, in Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st, 2011, pp.454-459.

DOI: 10.1109/ectc.2011.5898550

Google Scholar

[4] B.H. Kim and C.H. Moon, Comparison of the Thermal Performance of the Multichip LED Packages, Components, Packaging and Manufacturing Technology, IEEE Transactions on, vol. 2, pp.1832-1837, (2012).

DOI: 10.1109/tcpmt.2012.2200483

Google Scholar

[5] H. Ye, S. Koh, J. Wei, H. van Zeijl, and G. Zhang, Dynamic thermal simulation of high brightness LEDs with unsteady driver power output, in Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2012 13th International Conference on, 2012, p.1.

DOI: 10.1109/esime.2012.6191768

Google Scholar

[6] Z. Sauli, R. Vairavan, and V. Retnasamy, Heat Sink Fin Number Variation Analysis on Single Chip High Power LED, Applied Mechanics and Materials, vol. 487, pp.149-152, (2014).

DOI: 10.4028/www.scientific.net/amm.487.149

Google Scholar

[7] R. Vairavan, Z. Sauli, V. Retnasamy, P. Ehkan, and O. T. Say, 5mm X 5mm Copper-Diamond Composite Slug Stress Evaluation on LED, in Modelling Symposium (AMS), 2013 7th Asia, 2013, pp.78-81.

DOI: 10.1109/ams.2013.17

Google Scholar

[8] D. Butterworth and D. Council, Introduction to heat transfer vol. 18: Oxford University Press for the Design Council, the British Standards Institution and the Council of Engineering Institutions, (1977).

Google Scholar

[9] C. -J. Weng, Advanced thermal enhancement and management of LED packages, International Communications in Heat and Mass Transfer, vol. 36, pp.245-248, (2009).

DOI: 10.1016/j.icheatmasstransfer.2008.11.015

Google Scholar

[10] H. H. Cheng, D. -S. Huang, and M. -T. Lin, Heat dissipation design and analysis of high power LED array using the finite element method, Microelectronics Reliability, vol. 52, pp.905-911, (2012).

DOI: 10.1016/j.microrel.2011.05.009

Google Scholar