Solder Ball Robustness Comparison between SAC 387 and Polymer Solder Balls under AC and TC Reliability Test

Boon Kar Yap; Cai Hui Tan; Chou Yong Tan

doi:10.4028/www.scientific.net/AMM.789-790.61

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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vols. 789-790Solder Ball Robustness Comparison between SAC 387...

Solder Ball Robustness Comparison between SAC 387 and Polymer Solder Balls under AC and TC Reliability Test

Abstract:

Environment and the health concerns due to the hazardous effects of lead resulted in significant activities to find a replacement for lead-contained solders for electronics industrial. Majority of the semiconductor industrial are now replacing lead solders with Tin-Silver-Copper (SAC 387) solder balls. However, dropped balls in SAC 387 for Ball Grid Array (BGA) products due to poor solder joint strength caused by high thermal stress are a major concern in the semiconductor industries. Polymer core inside the solder ball (polymer core/Cu/Sn) is thus integrated to improve the solder ball joint strength. The function of polymer core inside the solder ball is to absorb and released the stress better as compared to the SAC 387 solder ball. Since the diffusion rate of Cu is faster than the diffusion rate of Sn, hence, this could caused the Kirkendall voids tends to form in between the Cu and Sn IMC layer. This would affect the solder ball joint strength and causing drop balls issue. By implement with an extra of Ni layer to the polymer core solder ball (core/Cu/Ni/Sn), could reduce the diffusion from Cu to Sn, thus to overcome the Kirkendall voids and to further improve the solder ball joint strength. This research work studies the performance of the solder ball shear strength of the two types of solder balls applied to MAPBGA device. In this research, both SAC 387 and polymer solder balls were went through under AC (Autoclave) and TC (Temperature Cycle) reliability test up to 144 hours and 1000 cycles, respectively. Solder ball shear strength test was conducted via Dage 4000 series bond tester. From the research work results of the two types of solder balls, the ball shear strength were decreased with an increased of aging and cycles. Overall, it can be concluded that the polymer core solder ball with an additional of Ni layer showed better performance than the polymer core without Ni layer and SAC 387 solder balls, after subjected to the AC and TC reliability test.

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Periodical:

Applied Mechanics and Materials (Volumes 789-790)

Pages:

61-65

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.789-790.61

Citation:

Cite this paper

Online since:

September 2015

Authors:

Boon Kar Yap*, Cai Hui Tan, Chou Yong Tan

Keywords:

IMC, Leadfree, Polymer Solder Ball, Solder Joint

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* - Corresponding Author

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