EBSD Analysis of Deformed and Partially Recrystallized Microstructures in ECAE-Processed Copper

O.V. Mishin; J.R. Bowen; Andrew Godfrey

doi:10.4028/www.scientific.net/MSF.715-716.825

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HomeMaterials Science ForumMaterials Science Forum Vols. 715-716EBSD Analysis of Deformed and Partially...

EBSD Analysis of Deformed and Partially Recrystallized Microstructures in ECAE-Processed Copper

Abstract:

The deformed microstructure and recrystallization behavior of copper samples processed using equal channel angular extrusion (ECAE) have been investigated. The heavily deformed microstructure was found to be non-uniform through the sample thickness and to vary in a manner consistent with the non-uniform distribution of strain imposed by processing. The through-thickness heterogeneity of the deformed microstructure resulted in a different extent of recrystallization in different layers during annealing. Recrystallized grains were also observed in samples that were not annealed, but stored at room temperature, which indicates that the deformed microstructure of ECAE-processed pure copper is unstable even at room temperature. In each sample, recrystallization was found to initiate in regions containing predominantly large misorientations.

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Periodical:

Materials Science Forum (Volumes 715-716)

Pages:

825-830

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.715-716.825

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Online since:

April 2012

Authors:

O.V. Mishin, J.R. Bowen, Andrew Godfrey

Keywords:

Copper, Equal Channel Angular Extrusion (ECAE), Partial Recrystallization, Severe Plastic Deformation (SPD)

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