The Additives Influence on Heat-Conducting Properties of Aluminium Nitride Circuit Boards

Aleksandr Karakulov; N.V. Gusev; Yuriy Yu. Drozdov; N.Y. Nikonova

doi:10.4028/www.scientific.net/KEM.712.226

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HomeKey Engineering MaterialsKey Engineering Materials Vol. 712The Additives Influence on Heat-Conducting...

The Additives Influence on Heat-Conducting Properties of Aluminium Nitride Circuit Boards

Abstract:

The paper presents the studies on evaluation of the influence of modified additives of Y₂O₃-, ZrO₂- and Li₂O₃-type on heat-conductive properties of aluminium-nitride ceramics used as circuit boards. Sintering of the studied samples was carried out using AlN powders and the powders of the modifying additives, mixed in the ball mill based on the spark plasma sintering system “SPS”. Density and heat conductivity were measured for the obtained samples. It was ascertained that the most significant level of heat conductivity was obtained when using the additive mixture made of 7 wt. % of Li₂O₃ and 3wt. % of Y₂O₃, which reaches the level of 160 W/m·K. In addition, the results of the studies show that the addition of the modified powders leads to a significant increase of density; the additive consisting of 7wt.% of Li₂O₃ and 3wt.% of Y₂O₃ produces the greatest effect.

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Periodical:

Key Engineering Materials (Volume 712)

Pages:

226-231

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.712.226

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Online since:

September 2016

Authors:

Aleksandr Karakulov*, N.V. Gusev, Yuriy Yu. Drozdov, N.Y. Nikonova

Keywords:

Aluminium-Nitride Ceramics, Heat-Conductive Properties, Modifying Additives, Spark Plasma Sintering, Substrates

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