Multiscale Finite Element Simulation of Forming Processes Based on Crystal Plasticity

Komi Soho; Farid Abed Meraim; Xavier Lemoine; Hamid Zahrouni

doi:10.4028/www.scientific.net/KEM.611-612.545

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Applications of Multi-Scale Models to Numerical Simulation and Experimental Analysis of Anisotropic Elastoplastic Behavior of Metallic Sheets
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HomeKey Engineering MaterialsKey Engineering Materials Vols. 611-612Multiscale Finite Element Simulation of Forming...

Multiscale Finite Element Simulation of Forming Processes Based on Crystal Plasticity

Abstract:

For the numerical simulation of sheet metal forming processes, the commercial finite element software packages are among the most commonly used. However, these software packages have some limitations; in particular, they essentially contain phenomenological constitutive models and thus do not allow accounting for the physical mechanisms of plasticity that take place at finer scales as well as the associated microstructure evolution. In this context, we propose to couple the Abaqus finite element code with micromechanical simulations based on crystal plasticity and a self-consistent scale-transition scheme. This coupling strategy will be applied to the simulation of rolling processes, at different reduction rates, in order to estimate the evolution of the mechanical properties. By following some appropriately selected strain paths (i.e., strain lines) along the rolling process, one can also predict the texture evolution of the material as well as other parameters related to its microstructure. Our numerical results are compared with experimental data in the case of ferritic steels produced by ArcelorMittal.

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Periodical:

Key Engineering Materials (Volumes 611-612)

Pages:

545-552

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.611-612.545

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Online since:

May 2014

Authors:

Komi Soho*, Farid Abed Meraim, Xavier Lemoine, Hamid Zahrouni

Keywords:

Coupling, Crystal Plasticity, Elasto-Plasticity, Finite Element, Self-Consistent Homogenization, Sheet Metal Forming Processes

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* - Corresponding Author

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