[1]
Mohd Salleh, M.A.A., et al., Wettability, Electrical and Mechanical Properties of 99. 3Sn-0. 7Cu/Si3N4 Novel Lead-free NanocompositeSolder. Advanced Materials Research, 2011. 277(1): pp.106-111.
Google Scholar
[2]
Hongtao Ma, Jeffrey C. Suhling (2009). A Review of Mechanical Properties of Lead-free Solders For Electronic Packaging, J Mater Sci, p.1141–1158.
DOI: 10.1007/s10853-008-3125-9
Google Scholar
[3]
Shen, J. and Y.C. Chan, Research advances in nano-composite solders. Microelectronics Reliability, 2009. 49(3): pp.223-234.
DOI: 10.1016/j.microrel.2008.10.004
Google Scholar
[4]
German, R.M., Powder metallurgy science. 2nd ed. 1994, Princeton, N.J.: Metal Powder Industries Federation (MPIF).
Google Scholar
[5]
Alam, M.E. and M. Gupta, Effect of addition of nano-copper and extrusion temperature on the microstructure and mechanical response of tin. Journal of Alloys and Compounds, 2009. 490(1-2): pp.110-117.
DOI: 10.1016/j.jallcom.2009.09.170
Google Scholar
[6]
Alam, M.E., S.M.L. Nai, and M. Gupta, Development of high strength Sn-Cu solder using copper particles at nanolengthscale. Journal of Alloys and Compounds, 2009. 476(1-2): pp.199-206.
DOI: 10.1016/j.jallcom.2008.09.061
Google Scholar
[7]
Nai, S., et al., Using Microwave-Assisted Powder Metallurgy Route and Nano-size Reinforcements to Develop High-Strength Solder Composites. Journal of Materials Engineering and Performance, 2010. 19(3): pp.335-341.
DOI: 10.1007/s11665-009-9481-z
Google Scholar
[8]
Gupta, X.L.Z. a.M., Development of lead-free Sn-0. 7Cu/Al2O3nanocomposite solders with superior strength. Journal of Physics D: Applied Physics, 2008. 41(9): p.095403.
DOI: 10.1088/0022-3727/41/9/095403
Google Scholar
[9]
Nai, S.M.L., J. Wei, and M. Gupta, Improving the performance of lead-free solder reinforced with multi-walled carbon nanotubes. Materials Science and Engineering: A, 2006. 423(1-2): pp.166-169.
DOI: 10.1016/j.msea.2005.10.072
Google Scholar
[10]
Nai, S.M.L., J. Wei, and M. Gupta, Influence of ceramic reinforcements on the wettability and mechanical properties of novel lead-free solder composites. Thin Solid Films, 2006. 504(1-2): pp.401-404.
DOI: 10.1016/j.tsf.2005.09.057
Google Scholar
[11]
Zhong, X.L. and M. Gupta. Effect of Type of Reinforcement at Nanolength Scale on the Tensile Properties of Sn-0. 7Cu Solder Alloy. inElectronics Packaging Technology Conference, 2008. EPTC 2008. 10th. (2008).
DOI: 10.1109/eptc.2008.4763510
Google Scholar
[12]
Babaghorbani, P., S.M.L. Nai, and M. Gupta, Reinforcements at nanometer length scale and the electrical resistivity of lead-free solders. Journal of Alloys and Compounds, 2009. 478(1-2): pp.458-461.
DOI: 10.1016/j.jallcom.2008.11.074
Google Scholar
[13]
Nai, S.M.L., et al. Enhancing the properties of a lead-free solder with the addition of Ni-coated carbon nanotubes. inElectronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on. (2009).
DOI: 10.1109/icept.2009.5270691
Google Scholar
[14]
Mohan Kumar, K., V. Kripesh, and A.A.O. Tay. Sn-Ag-Cu lead-free composite solders for ultra-fine-pitch wafer-level packaging. inElectronic Components and Technology Conference, 2006. Proceedings. 56th. (2006).
DOI: 10.1109/ectc.2006.1645653
Google Scholar
[15]
Kangooie, M., R. Mahmudi, and A.R. Geranmayeh, Impression Creep of a Lead-Free Sn-1. 7Sb-1. 5Ag Solder Reinforced by Submicron-Size Al2O3 Particles. Journal of Electronic Materials, 2009. 39(2): pp.215-222.
DOI: 10.1007/s11664-009-0971-4
Google Scholar
[16]
Manko, H.H., Solders and soldering : materials, design, production, and analysis for reliable bonding. 4th ed. 2001, New York: McGraw-Hill.
Google Scholar
[17]
Gupta, M. and W.L.E. Wong, Microwaves and metals. 2007, Singapore: John Wiley & Sons.
Google Scholar
[18]
Mohd Salleh, M.A.A., et al., Mechanical properties of Sn-0. 7Cu/Si3N4 lead-free composite solder. Materials Science and Engineering: A, 2012(0).
DOI: 10.1016/j.msea.2012.07.039
Google Scholar
[19]
M.A. A, M.S., et al., Solderability of Sn-0. 7Cu/Si3N4 lead-free composite solder on Cu-substrate. Physics Procedia, 2011. 22(0): pp.299-304.
DOI: 10.1016/j.phpro.2011.11.047
Google Scholar
[20]
Guo, F., Composite lead-free electronic solders. Journal of Materials Science: Materials in Electronics, 2007. 18(1): pp.129-145.
Google Scholar
[21]
Abtew, M. and G. Selvaduray, Lead-free Solders in Microelectronics. Materials Science and Engineering: R: Reports, 2000. 27(5â€"6): pp.95-141.
DOI: 10.1016/s0927-796x(00)00010-3
Google Scholar
[22]
Dai, J., et al., Preparation of Ni-coated Si3N4 powders via electroless plating method. Ceramics International, 2009. 35(8): pp.3407-3410.
DOI: 10.1016/j.ceramint.2009.06.007
Google Scholar
[23]
Thomas Siewert, S.L., David R. Smith, Juan Carlos Madeni. Properties of Lead-Free Solders Release 4. 0. 2002 Feb 11.
Google Scholar
[24]
Ziegler, G., J. Heinrich, and G. Wötting, Relationships between processing, microstructure and properties of dense and reaction-bonded silicon nitride. Journal of Materials Science, 1987. 22(9): pp.3041-3086.
DOI: 10.1007/bf01161167
Google Scholar
[25]
Wanbao, H., et al., Preparation and sintering of Ni-coated Si3N4 composite powders. Ceramics International, 2005. 31(6): pp.811-815.
DOI: 10.1016/j.ceramint.2004.09.008
Google Scholar