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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 1120-1121Investigation of Ni-Microalloyed Sn-0.5Cu...

Investigation of Ni-Microalloyed Sn-0.5Cu Lead-Free Solders

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Abstract:

In this study the effects of small amounts of nickel addition (0-2000 ppm) on the microstructure, on Cu6Sn5 intermetallic compound formation and the mechanical properties of a Sn-0.5Cu lead-free solder were investigated. It is known that even ppm level additions of Ni have significant effects on the microstructure of Sn-Cu solder alloys. Ni suppresses the growth of β-Sn dendrites in favour of eutectic formation. As the nickel content increases, the microstructure undergoes a morphology evolution from hypoeutectic through fully eutectic to hypereutectic. Furthermore, the presence of Ni in the Cu6Sn5 intermetallic compound phase stabilises its high-temperature allotrope η-Cu6Sn5.

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Periodical:

Advanced Materials Research (Volumes 1120-1121)

Pages:

466-472

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.1120-1121.466

Citation:

Cite this paper

Online since:

July 2015

Authors:

Anett Gyenes*, Erzsebet Nagy, Péter Lanszki, Zoltán Gácsi

Keywords:

Lead-Free Solder, Mechanical Properties, Microstructure, Ni Addition, Sn-0.5Cu, X-Ray Diffraction

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* - Corresponding Author

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