193 nm Immersion Lithography - Taking The Plunge

Ralph Dammel; Frank M. Houlihan; Raj Sakamuri; David Rentkiewicz; Andrew Romano

doi:10.2494/photopolymer.17.587

Ralph Dammel, Frank M. Houlihan, Raj Sakamuri, David Rentkiewicz, Andrew Romano

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Keywords: immersion lithography, 193 nm lithography, antireflecting coating, flavored water

JOURNAL FREE ACCESS

2004 Volume 17 Issue 4 Pages 587-601

DOI https://doi.org/10.2494/photopolymer.17.587

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Abstract

This paper reviews the current status and future outlook of materials for 193 nm immersion lithography, with special focus on top barrier layers, photoresists, bottom antireflective coatings for numerical apertures exceeding unity, and future challenges for imaging materials along the Roadmap.

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