A Portrait of Copper Processed by Equal Channel Angular Pressing

Ralph J. Hellmig; Miloš Janecek; Branislav Hadzima; Oleg V. Gendelman; Michael Shapiro; Xenia Molodova; André Springer; Yuri Estrin

doi:10.2320/matertrans.ME200717

Ralph J. Hellmig, Miloš Janecek, Branislav Hadzima, Oleg V. Gendelman, Michael Shapiro, Xenia Molodova, André Springer, Yuri Estrin

Author information

Ralph J. Hellmig
Department of Materials Science and Technology, Clausthal University of Technology
Miloš Janecek
Department of Physics of Materials, Charles University
Branislav Hadzima
Faculty of Mechanical Engineering, University of \\v{Z}ilina
Oleg V. Gendelman
Faculty of Mechanical Engineering, Technion, Israel Institute of Technology
Michael Shapiro
Faculty of Mechanical Engineering, Technion, Israel Institute of Technology
Xenia Molodova
Institut für Metallkunde und Metallphysik, RWTH Aachen
André Springer
Department of Materials Science and Technology, Clausthal University of Technology
Yuri Estrin
ARC Centre of Excellence for Design in Light Metals, Department of Materials Engineering, Monash University

Keywords: copper, severe plastic deformation, equal channel angualar pressing, mechanical properties, thermal stability, thermal conductivity, corrosion behaviour

JOURNAL FREE ACCESS

2008 Volume 49 Issue 1 Pages 31-37

DOI https://doi.org/10.2320/matertrans.ME200717

View "Advance Publication" version (September 28, 2007).

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Abstract

Copper is one of the most important materials used for electrical connectors with a high thermal and electricial conductivity, and there is an ongoing demand to improve its mechanical properties without sacrificing other beneficial properties. A possible approach to achieving this aim is to use the method of severe plastic deformation to obtain an ultrafine grained microstructure. Significant grain refinement obtained by equal channel angular pressing (ECAP) leads to an improvement of mechanical, microstructural and physical properties. This paper gives an overview of a range of the properties that can be achieved by ECAP processing of pure copper including microstructural features, thermal stability, thermal conductivity and corrosion resistance.

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