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Optimization of the thermal performance of multi-layer silicon microchannel heat sinks

Xu Shanglong (University of Electronic Science and Technology of China, Department of Mechatronics Engineering, Chengdu, China)
Wu Yihao (University of Electronic Science and Technology of China, Department of Mechatronics Engineering, Chengdu, China)
Cai Qiyu (University of Electronic Science and Technology of China, Department of Mechatronics Engineering, Chengdu, China)
Yang Lili (University of Electronic Science and Technology of China, Department of Mechatronics Engineering, Chengdu, China)
Li Yue (University of Electronic Science and Technology of China, Department of Mechatronics Engineering, Chengdu, China)

The objective is to optimize the configuration sizes and thermal performance of a multilayer silicon microchannel heat sink by the thermal resistance network model. The effect of structural parameter on the thermal resistance is analyzed by numercal simulation. Taking the thermal resistance as an objective function, a nonlinear and multi-constrained optimization model are proposed for the silicon microchannel heat sink in electronic chips cooling. The sequential quadratic programming (SQP) method is used to do the optimization design of the configuration sizes of the microchannel. For the heat sink with the size of 20mm×20mm and the power of 400 W, the optimized microchannel number, layer, height and width are 40 and 2, 2.2mm and 0.2mm, respectively, and its corresponding total thermal resistance for whole microchannel heat sink is 0.0424 K/W.

Keywords: optimization, microchannel, sequential quadratic programming, thermal resistance, multi-layer