Science of Sintering 2014 Volume 46, Issue 1, Pages: 15-21
https://doi.org/10.2298/SOS1401015I
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Effect of sintering temperature on electrical and microstructure properties of hot pressed Cu-TiC composites
Islak S. (Kastamonu University, Faculty of Engineering and Architecture, Department of Materials Science and Nanotechnology Engineering, Kastamonu, Turkey)
Kır D. (Kocaeli University, Hereke Vocational High School, Kocaeli, Turkey)
Buytoz S. (Firat University, Faculty of Technology, Department of Metallurgy and Materials Engineering, Elazig, Turkey)
In this study, Cu-TiC composites were successfully produced using hot
pressing method. Cu-TiC powder mixtures were hot-pressed for 4 min at 600,
700 and 800°C under an applied pressure of 50 MPa. Phase composition and
microstructure of the composites hot pressed at different temperatures were
characterized by X-ray diffraction, scanning electron microscope, and optic
microscope techniques. Microstructure studies revealed that TiC particles
were distributed uniformly in the Cu matrix. With the increasing sintering
temperature, hardness of composites changed between 64.5 HV0.1 and 85.2
HV0.1. The highest electrical conductivity for Cu-10 wt.% TiC composites was
obtained for the sintering temperature of 800°C, with approximately 68.1%
IACS.
Keywords: Cu-TiC composites, electrical conductivity, microstructure, sintering temperature