A Comprehensive Thermal Model For System-Level Electric Drivetrain Simulation With Respect To Heat Exchange Between Components

Chen, Bicheng; Andert, Jakob Lukas; Manns, Patrick; Birmes, Georg; Pischinger, Stefan; Etzold, Konstantin; Wulff, Carsten Wilhelm Ingo

doi:978-1-7281-9764-7

A Comprehensive Thermal Model For System-Level Electric Drivetrain Simulation With Respect To Heat Exchange Between Components

Chen, Bicheng (Corresponding author)^RWTH* ; Wulff, Carsten Wilhelm Ingo^RWTH* ; Etzold, Konstantin^RWTH* ; Manns, Patrick^RWTH* ; Birmes, Georg^RWTH* ; Andert, Jakob Lukas^RWTH* ; Pischinger, Stefan^RWTH*

In
Proceedings of the Nineteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems : ITherm 2020 : ITherm Virtual Conference, July 21-23, 2020 (originally scheduled for May 26-29, 2020), Walt Disney World, Orlando, FL, USA / IEEE, IEEE Electronic Packaging Society, Seiten/Artikel-Nr: 558-567

2020 & 2021

Konferenz/Event:19. IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems , Orlando, FL , USA , ITherm , 2020-07-21 - 2020-07-23

ImpressumPiscataway, NJ : IEEE

Umfang558-567

ISBN978-1-7281-9763-0, 978-1-7281-9764-7, 978-1-7281-9765-4