HotSpot 6.0: Validation, Acceleration and Extension
ReportAuthors:Zhang, Runjie, Department of Computer ScienceUniversity of Virginia Stan, Mircea, Department of Computer ScienceUniversity of Virginia Skadron, Kevin, Department of Computer ScienceUniversity of Virginia
Abstract:
The challenge of removing the heat generated by microprocessors with reasonable cost has long been identified as a critical issue. As a matter of fact, the cooling constraint (a.k.a., thermal wall) has became a major hurdle that limits the scaling of operating frequency and transistor density. As a fast and accurate thermal model, HotSpot enables early-stage evaluation of chip temperature and therefore supports architectural study of dynamic thermal management strategies, chip floorplanning, and novel cooling solutions.
Rights:
All rights reserved (no additional license for public reuse)
All rights reserved (no additional license for public reuse)
Language:
English
English
Source Citation:
Zhang, Runjie, Mircea Stan, and Kevin Skadron. "HotSpot 6.0: Validation, Acceleration and Extension." University of Virginia Dept. of Computer Science Tech Report (2015).
Publisher:
University of Virginia, Department of Computer Science
University of Virginia, Department of Computer Science
Published Date:
2015
2015