Skip to main content
SpringerLink
Log in

Mechanical Properties of CuNi Films

  • Published:
MRS Online Proceedings Library Aims and scope

Abstract

The mechanical properties of resistive CuNi films sputtered on both silicon wafers and flexible Kapton foils are important for reliability and lifetime of resistors. Studies of stress-temperature dependence and stress relaxation, stress-strain measurements and scanning scratch tests were performed to investigate film stresses, elastic properties, plastic flow, stress for crack initiation and film adhesion. The growth and annealing stresses were found to be tensile and can be seen as the reason for resistance degradation by stress relaxation due to plastic flow. The strains for crack initiation of 0.2 % to 0.7 % depending on film thickness and annealing restrict the application in resistors on flexible substrates. The film adhesion can be improved by a NiCr base-layer.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Similar content being viewed by others

References

  1. I. Nishino, Y. Ichinose, Y. Sorimachi, and I. Tsubata, Int. J. Hybrid Microelectronics 6, 18 (1985).

    Google Scholar 

  2. W. Brückner, J. Schumann, H. Grießmann, phys. stat. sol. (a) 140, K21 (1993).

    Article  Google Scholar 

  3. W. Brückner, St. Baunack, G. Reiss, G. Leitner, Th. Knuth, Thin Solid Films 258, 252 (1995).

    Article  Google Scholar 

  4. W. Brückner, St. Baunack, D. Elefant, G. Reiss, J. Appl. Phys., in press.

  5. W. Brückner, J. Schumann, St. Baunack, W. Pitschke, Th. Knuth Thin Solid Films 258, 236 (1995).

    Article  Google Scholar 

  6. M. F. Doerner, W. D. Nix, CRC Critical Reviews in Solid State and Materials Sciences 14, 225 (1988).

    Article  CAS  Google Scholar 

  7. W. Brückner, phys. stat. sol. (a) 148, K89 (1995).

    Article  Google Scholar 

  8. W. Brückner, J. Edelmann, H. Vinzelberg, G. Reiss, Th. Knuth, Thin Solid Films, in press.

  9. F. Kohlrausch, Praktische Physik, B. G. Teubner, Stuttgart, 1968, p. 22.

    Google Scholar 

Download references

Author information

Authors and Affiliations

  1. Institute for Solid State and Materials Research Dresden, Institute for Solid State Research, D-0 1171, Dresden, Germany

    W. Brückner, F. Macionczyk & G. Reiss

Authors
  1. W. Brückner
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. F. Macionczyk
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. G. Reiss
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to W. Brückner.

Rights and permissions

Reprints and permissions

About this article

Cite this article

Brückner, W., Macionczyk, F. & Reiss, G. Mechanical Properties of CuNi Films. MRS Online Proceedings Library 436, 47–52 (1996). https://doi.org/10.1557/PROC-436-47

Download citation

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1557/PROC-436-47

Search

Navigation