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Electrochemical Deposition of Platinum Interconnects on Flexible Biocompatible Substrates

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Abstract

We explored the use of galvanostatic electrochemical deposition of Pt for cost-effective fabrication of interconnects in flexible implantable bio-medical devices. Initial studies were done on coupons diced from 200 mm Si wafers coated with PVD TiN. Based on the physical and chemical properties of the electrodeposited Pt films, optimal conditions were chosen for through-mask plating of centimeters long Pt lines on flexible, medical grade, releasable polyimide layers. Possibility for further up-scaling was considered with special emphasis on high throughput manufacturing of Pt interconnects with good adhesion to TiN/flexible substrates, low impurity content and resistivity, and acceptable roughness and uniformity.

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Authors and Affiliations

  1. imec, Kapeldreef 75, Leuven, Belgium

    A. Radisic, B. M. Morcos, M. Op de Beeck, J. M. O’Callaghan & C. Van Hoof

  2. KACST-Intel Consortium CENA, Riyadh, Saudi Arabia

    B. M. Morcos

  3. Chemistry Department, Faculty of Science, Alexandria University, Egypt

    B. M. Morcos

Authors
  1. A. Radisic
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  2. B. M. Morcos
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  3. M. Op de Beeck
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  4. J. M. O’Callaghan
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  5. C. Van Hoof
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Radisic, A., Morcos, B.M., Op de Beeck, M. et al. Electrochemical Deposition of Platinum Interconnects on Flexible Biocompatible Substrates. MRS Online Proceedings Library 1626, 1007 (2014). https://doi.org/10.1557/opl.2014.45

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  • DOI: https://doi.org/10.1557/opl.2014.45

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