Abstract
In situ scanning electron microscopy was performed during elevated-temperature (⩽760 °C) tensile-creep deformation of a face-centered-cubic cobalt-based Udimet 188 alloy to characterize the deformation evolution and, in particular, the grain boundary-cracking evolution. In situ electron backscatter diffraction observations combined with in situ secondary electron imaging indicated that general high-angle grain boundaries were more susceptible to cracking than low-angle grain boundaries and coincident site-lattice boundaries. The extent of general high-angle grain-boundary cracking increased with increasing creep time. Grain-boundary cracking was also observed throughout subsurface locations as observed for postdeformed samples. The electron backscattered diffraction orientation mapping performed during in situ tensile-creep deformation proved to be a powerful means for characterizing the surface deformation evolution and in particular for quantifying the types of grain boundaries that preferentially cracked.
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Acknowledgments
This work was supported by the National Science Foundation through Grant DMR-0533954. The author is grateful to Mr. Nathan Eisinger (Special Metals Corporation, Huntington, WV) for overseeing the alloy processing, and to Mr. John Carpenter of EDAX-TSL, Inc. for his technical assistance.
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Boehlert, C., Longanbach, S., Nowell, M. et al. The evolution of grain-boundary cracking evaluated through in situ tensile-creep testing of Udimet alloy 188. Journal of Materials Research 23, 500–506 (2008). https://doi.org/10.1557/JMR.2008.0058
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DOI: https://doi.org/10.1557/JMR.2008.0058