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Effect of solid solution impurities on dislocation nucleation during nanoindentation

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Abstract

Dislocation nucleation in solid solutions of face-centered-cubic metallic materials was studied using nanoindentation. The effects of solute impurities in the copper–nickel system on the formation of dislocations in a previously dislocation-free region were demonstrated to be minimal. The shear stress required to nucleate dislocations in copper is approximately 1.6 GPa, while in nickel a 3.9 GPa shear stress is required. Changes in shear stress for nucleation track closely with changes in elastic modulus showing the nucleation stress is approximately 1/30 to 1/20 of the shear modulus. The expected solid-solution strengthening is identified within the same experimental method, demonstrating unambiguously the fact that solid-solution impurities in this system will impact the propagation of dislocations during plastic deformation but not alter the homogeneous nucleation of dislocations in these materials.

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Authors and Affiliations

  1. School of Mechanical and Materials Engineering, Washington State University, Pullman, Washington, 99164-2920, USA

    D. F. Bahr & G. Vasquez

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  1. D. F. Bahr
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  2. G. Vasquez
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Correspondence to D. F. Bahr.

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Bahr, D.F., Vasquez, G. Effect of solid solution impurities on dislocation nucleation during nanoindentation. Journal of Materials Research 20, 1947–1951 (2005). https://doi.org/10.1557/JMR.2005.0244

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  • DOI: https://doi.org/10.1557/JMR.2005.0244

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