Abstract
Xerogel films of high porosity were fabricated using an ambient pressure technique. The same porosity can be obtained with different microstructures by varying the aging time of the films. The dielectric constant of these films as a function of porosity at 1 MHz follows correlations originally developed for bulk aerogels. Diffusion of copper is orders of magnitude faster in these xerogels than in the corresponding thermal oxide. An activation energy of 0.9 eV was estimated based on a convective diffusion model.
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References
Brinker, C. J., and G.W. Scherer, Sol-Gel Science. Academic Press, New York, (1990).
Hrubesh, L. H., and J.F. Poco, J. Non-Cryst. Solids, 188, 46, (1995).
Jo, M-H, J-K. Hong, H-H. Park, J-J. Kim, and S-H. Hyun, Microelectronic Engineering, 33, 343, (1997).
Jo, M-H., J-K. Hong, H-H. Park, J-J. Kim, S-H. Hyun, and S-Y. Choi, Thin Solid Films, 308, 490, (1997).
Jo, M-H., H-H. Park, D-J. Kim, S-H. Hyun, S-Y. Choi, and J-T. Paik, J. Appl. Phys. 82, 1299, (1997).
Prakash, S. S., C.J. Brinker, A.J. Hurd, J. Non-Cryst. Solids, 190, 264, (1995).
Prakash, S. S., C.J. Brinker, A.J. Hurd, and S.M. Rao, Nature, 374, 439, (1995).
List, R. S., C. Jin, S.W. Russell, S. Yamanaka, L. Olsen, L. Le, L.M. Ting, R.H. Havemann, (1997) Symposium on VLSI Tech. Digest of Tech. Papers, p. 77–79.
Zielinski, E. M., S.W. Russell, R.S. List, A.M. Wilson, C. Jin, K.J. Newton, J.P. Lu, T. Hurd, W.Y. Hsu, V. Cordasco, M. Gopikanth, V. Korthuis, W. Lee, G. Cerny, N.M. Russell, P.B. Smith, S. O’Brien, and R.H. Havemann, IEDM 1997, p. 31.7.1–3.
Smith, D.M., J. Anderson, C.C. Cho, G.P. Johnston, and S.P. Jeng, Mat. Res. Soc. Symp. Proc, 381, 261, (1995).
Jin, C, J.D. Luttmer, D.M. Smith, and A.T. Ramos, MRS Bulletin, p. 39–42, Oct. (1997).
Smith, D. M., J. Anderson, C-C. Cho, and B.E. Gnade, Mat. Res. Soc. Symp. Proc, 371, 261, (1995).
Yang, H-S, S-Y. Choi, S-H. Hyun, H-H. Park, and J-K. Hong, J. Non-Cryst. Solids, 221, 151, (1997).
Hong, J-K., H-S. Yang, M-H. Jo, H-H. Park, and S-Y. Choi, Thin Solid Films, 308, 495, (1997).
Yamane and S. Okano, Yogyo Kyokai-shi, 87, 56, (1979).
Davis, P.J., C.J. Brinker, and D.M. Smith, J. Non-Cryst. Solids, 142, 189, (1992).
Haereid, S., J. Anderson, M. A. Einarsrud, D. W. Hua, D.M. Smith, J. Non-Cryst. Solids, 185, 221, (1995).
Haereid, S., E. Nilsen, V. Ranum, and M. A. Einarsrud, J. Sol-Gel Sci. and Tech., 8, 153, (1997).
MacBrayer, J. D., R.M. Swanson, and T.W. Sigmon, J. Electrochemical Society, 133 1424, (1986).
Raghavan, G., C. Chiang, P. B. Anders, S. Tzeng, R. Villasol, G. Bai, M. Bohr and D. B. Fraser, Thin Solid Films, 262, 168, (1995).
Shacham-Diamand, Y., A. Dedhia, D. Hoffstetter and W.G. Oldham, J. Electrochemical Society, 140, 2427, (1993).
Gupta, D., Materials Chemistry and Physics, 41, 199, (1995).
Gupta, D., K. Vieregge and K.V., Appl. Phys. Lett., 61, 2178, (1992).
Faupel, F., D. Gupta, B. D. Silverman and P.S. Ho, Appl. Phys. Lett., 55, 357, (1989).
Gupta, D., F. Faupel and R. Willecke, in H. Jain and D. Gupta (eds.), Diffusion in Amorphous Materials. The Minerals, Metals and Matls. Soc, Warrendale. PA, 1994, p. 189.
Hrubesh, L.W., L.E. Keene and V.R. Lattore, J. Materials Res., 8, No. 7, p. 1736, (1993).
Hrubesh, L.W., and J. F. Poco, Mat. Res. Symp. Proc. 371, 195, (1995).
Bruesch, P., F. Stucki, Th. Baumann, P. Kluge-Weiss, B. Brühl, L. Niemeyer, R. Strumpler, B. Ziegler and M. Mielke, J. Appl. Phys A, 57, 329, (1993).
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Nitta, S., Jain, A., Pisupatti, V. et al. Fabrication and Characterization of Spin-On Silica Xerogel Films. MRS Online Proceedings Library 511, 99–104 (1998). https://doi.org/10.1557/PROC-511-99
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DOI: https://doi.org/10.1557/PROC-511-99