Investigation of Dynamical Temperature Behaviour in Rtp

Abstract

For Rapid Thermal Processing one of the essential problems is the dvnamical temperature controlling to reduce temperature nonhomogeneities during heating up and cooling down, which are responsible for layer nonhomogeneities and slip generation. A pyrometer row consisting of five sensors is used for temperature distribution measurement in radial direction, which allows to investigate the dynamical behaviour during the heating cycles. Together with a developed software tool, which is suitable for calculation of the dynamical temperature distribution across the wafer under process conditions where the convective heat losses can be neglected, the influence of heating-up velocities is investigated. The obtained results show that in a scalar controlled system process conditions optimized for steady state lead to maximum temperature nonhomogeneity during the heating-up period, due to the changing heat balance in the system.