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Ductile-to-brittle transition induced by increasing strain rate in Sn–3Cu/Cu joints

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Abstract

The current study revealed the effects of strain rate on tensile strength and ductile-to-brittle transition of Sn–3Cu/Cu joints in the strain rate range of 4.2 × 10−5 to 2.4 × 10−1 s−1. Experimental results indicate that these joints broke in a ductile manner at low strain rates with a rapid increase in the tensile strength but displayed a brittle manner at higher strain rates with a slow increase in the tensile strength, indicating a typical ductile-to-brittle transition feature. A method was proposed to estimate the interfacial strength between the solder and the intermetallic compounds.

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Acknowledgments

The authors would like to thank Q.Q. Duan, W. Gao, J.T. Fan, H.H. Su, F. Yang, P. Zhang, and Q.S. Zhu for mechanical tests, SEM observations, and stimulating discussion. This work was financially supported by National Basic Research Program of China under Grant No. 2004CB619306 and the National Outstanding Young Scientist Foundation under Grant No. 50625103.

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  1. Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Science, Shenyang, 110016, People’s Republic of China

    H.F. Zou & Z.F. Zhang

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  1. H.F. Zou
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  2. Z.F. Zhang
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Correspondence to Z.F. Zhang.

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Zou, H., Zhang, Z. Ductile-to-brittle transition induced by increasing strain rate in Sn–3Cu/Cu joints. Journal of Materials Research 23, 1614–1617 (2008). https://doi.org/10.1557/JMR.2008.0214

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  • DOI: https://doi.org/10.1557/JMR.2008.0214

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